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Advanced Electronics Packaging Digest

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Axcelis to Build New Manufacturing Facility in Pyeongtaek, Korea

09/16/2026 | PRNewswire
Axcelis Technologies, Inc. , a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced plans to invest $35 million in its global manufacturing infrastructure through the construction of a new ion implantation equipment manufacturing facility in Pyeongtaek, Gyeonggi Province, Korea.

Microelectronics Network Launches Semiconductor Workforce Advisory Committee

09/15/2026 | SEMI
The National Network for Microelectronics Education (NNME) announced the formation of its inaugural Industry Advisory Committee, bringing together senior leaders from the semiconductor industry, universities, and community colleges to help guide the network's national workforce strategy and strengthen the talent pipeline supporting America's growing microelectronics ecosystem.

Intel Foundation, PLTW Expand Pathways to Semiconductor Careers

09/14/2026 | Intel Corporation
The future of semiconductor innovation depends on a strong pipeline of skilled talent.

Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

MacDermid Alpha Highlights Silver Alternative Die Attach for Cost-Stable Semiconductor Manufacturing at SEMICON India 2026

09/10/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at SEMICON India 2026, September 17–19, at Yashobhoomi, the India International Convention and Expo Centre (IICC), in Dwarka, New Delhi. Visitors can meet the company at Booth H6807 to discuss ALPHA® ATROX® CD 560-1, a PFAS-free silver alternative conductive die attach paste for metal leadframe semiconductor packages.
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