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Indium Halogen-Free Solder Paste Wins Mexico Technology Award

10/16/2026 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, received a Mexico Technology Award in the solder paste category for its Indium12.9HF, a no-clean, halogen-free solder paste designed to meet the growing challenges of high-density, fine-pitch assemblies.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.
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