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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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I-Connect007 Welcomes Newest Columnist, Echo Yang of Archer Circuits

10/12/2026 | I-Connect007
I-Connect007 is excited to welcome Echo Yang, founder and president of Archer Circuits, as its newest columnist. As a female owner of a large Asian PCB company, Echo brings her candid, energetic, and practical view of the global PCB business to her column, The Fearless Connector. She will address the differences between Chinese and North American manufacturing, her own struggles to start a business, and some details about DFM, engineering, Gerber files, and the risks of treating RF, rigid-flex, and other demanding products like ordinary FR-4 work. She approaches it all with her own youthful, entrepreneurial spirit.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

Connect the Dots: Getting the PCB Quote Right

09/30/2026 | Matt Stevenson -- Column: Connect the Dots
Once the PCB design moves from the designer’s hands to the fabricator, the quote process becomes much more than a matter of price. It’s where we determine what it will take to build your board successfully, from materials and capabilities to cost and production requirements. The more closely designers and fabricators work together during this stage, the better the opportunity to identify potential problems before they reach production.

WELLER Highlights IPC Class and CTI for Reliable PCB Manufacturing

09/24/2026 | ACCESSWIRE
WELLER PCB is highlighting the importance of defining IPC manufacturing class and PCB laminate requirements before a project enters production, especially for industrial, high-voltage and reliability-sensitive electronics.

ASC Sunstone Circuits to Exhibit and Present Lunch-and-Learn at PCB West 2026

09/21/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California. The PCB West exhibition will be held Wednesday, September 30.
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