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Advanced Electronics Packaging Digest

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CPO Optical-Electrical Testing Drives Test Equipment Supply Chain Shift

10/13/2026 | TrendForce
TrendForce’s latest research on AI interconnect technologies reveals that growing demand for high-speed transmission in AI data centers is accelerating the transition of co-packaged optics (CPO) toward mass production, making shorter test times and lower costs increasingly important.

Six Suppliers Bet on VCSEL NPO as Demand Hits 650 Million Units by 2031

10/09/2026 | TrendForce
TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO).

CScale Exits Stealth With $145M to Build AI Interconnects

09/30/2026 | BUSINESS WIRE
CScale exited stealth, announcing $145 million in Series C funding to accelerate development and commercialization of optical interconnect for AI scale-up, the high-bandwidth, ultra-low-latency connections that let accelerators work together like a single, much larger computer.

Vuzix Introduces Shrike Defense Display Platform and Ships Initial Evaluation Units

09/29/2026 | PRNewswire
Vuzix® Corporation, a supplier of AI-powered smart glasses, waveguides for smart glasses and co-packaged optical data center interconnects, and related augmented reality technologies, introduced Vuzix Shrike™, a configurable waveguide display platform for defense, security and first responder applications.

SMART Photonics, GlobalFoundries Partner on Open-Access Silicon-Photonics Foundry Service

09/24/2026 | GlobalFoundries
SMART Photonics B.V. announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART Photonics’ high-volume indium phosphide photonic integrated circuits (PICs), including lasers and modulators.
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