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Zhen Ding Technology Holding Limited, a leading global PCB manufacturer, reported September 2026 revenue of NT$26,358 million, up 36.13% YoY and 27.54% MoM, setting a new monthly revenue record. Third-quarter revenue reached NT$64,624 million, up 36.44% YoY, while cumulative revenue for the first nine months totaled NT$153,783 million, up 22.39% YoY. Both figures also reached record highs for their respective periods.
According to Zhen Ding, September revenue surpassed NT$26.0 billion, setting a new monthly record and marking another milestone for the company. Revenue from Mobile Communication products posted double-digit growth both YoY and MoM, as shipments of customers’ new products continued to gain momentum during the seasonal upcycle. Meanwhile, demand for Servers/Optical Modules/IC Substrates remained strong, with combined revenue more than tripling YoY and reaching another monthly record, making them an increasingly important growth driver for the company.
Looking ahead to the fourth quarter, Zhen Ding expects seasonal strength in mobile communication products to continue, while high-speed optical modules and AI servers are also expected to maintain strong momentum. This should support continued sequential growth in consolidated revenue, with the fourth quarter expected to mark the highest quarterly revenue level of the year, consistent with the company’s historical seasonal pattern. As its established consumer electronics businesses continue to grow steadily and AI-related products ramp up at a faster pace, Zhen Ding is increasingly benefiting from two distinct growth engines: steady growth in consumer electronics and rapid expansion in high-end AI applications.
In addition, Zhen Ding will participate in TPCA Show 2026 from October 20 to 22, showcasing a comprehensive portfolio of high-end PCB products and the latest technologies for the AI era. The company will continue to strengthen its capabilities in AI computing and high-speed transmission applications, while positioning itself to capture the next wave of growth in high-end PCBs driven by the ongoing expansion of AI infrastructure.
