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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

TTM Completes 2025 Buyback, Authorizes New $100M Repurchase Program

10/30/2026 | Globe Newswire
TTM Technologies, Inc. announced it has completed its existing authorized share repurchase program, which was previously announced on May 8, 2025.

TTM Technologies Reports Record Q3 2026 Sales of $1.2 Billion, Up 60% YoY

10/22/2026 | Globe Newswire
Net sales in the third quarter of 2026 were $1.2 billion, compared to $752.7 million in the third quarter of 2025.

TTM Technologies Completes Acquisition of Epiq Solutions

10/01/2026 | TTM Technologies
Through the close of the transaction, TTM adds a talented management and operational team focused on critical technologies in the long-cycle Aerospace & Defense end market, with strategic and complementary capabilities that TTM expects will bolster TTM’s long-term growth strategy.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

TTM Technologies to Acquire Epiq Solutions to Expand Advanced Technology Offerings

08/17/2026 | Globe Newswire
This acquisition reinforces TTM’s Strategy to Drive Long-Term Sustainable Results for Shareholders. TTM continues to balance its portfolio with investments for growth in fast growing markets.
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