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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Infineon, Wolfspeed Sign 200mm SiC Wafer Supply Agreement

10/15/2026 | Infineon
Infineon Technologies AG and Wolfspeed, Inc. have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology.

Flex Acquires EPC Power to Expand AI Data Center Power Solutions

10/14/2026 | Flex
Flex announced that it has completed its acquisition of EPC Power, a leading provider of intelligent power conversion solutions for data center and grid applications.

Infineon Showcases AI-Era Technologies at electronica 2026

10/14/2026 | Infineon
With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever.

Wolfspeed Secures Conditional $1.5B U.S. Defense Loan Commitment

10/14/2026 | Wolfspeed
Wolfspeed, Inc. announced it has received a conditional loan commitment letter from the U.S. Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

Scale-Up: From Monolithic Silicon to Advanced Packaging

10/15/2026 | Chetan Arvind Patil, Marvell Technology
This is the first in a three-part series exploring scale-up, scale-out, and scale-across in advanced packaging. Scale-up focuses on increasing compute capability, memory capacity, and communication bandwidth within tightly integrated computing systems. Scale-out expands computing capacity by connecting multiple servers, compute nodes, and racks through high-speed networks. Scale-across focuses on integrating and coordinating diverse computing resources, technologies, and workloads across data centers to improve overall efficiency and resource utilization.
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