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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Siemens Expands NVIDIA AI Collaboration for 3D IC Power and Thermal Challenges

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Below the Surface: What Engineers Find Challenging About High Frequency Signal Integrity

09/17/2026 | Chandra Gupta -- Column: Below the Surface
How do materials affect RF signal performance? It’s a fair question, and most will assume they already understand the answer. But this misunderstanding is exactly why so many high frequency designs underperform, require rework, or worse, fail in the field. Below the surface, where signal integrity is either preserved or destroyed, the truth is that at high frequencies, material selection matters, and that’s where most engineers get it wrong.
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