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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

10/21/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.

Mercedes-Benz, NVIDIA Expand Partnership on Automated Driving

10/19/2026 | NVIDIA
Mercedes-Benz and NVIDIA announced that they will extend their strategic partnership to advance the next generation of automated driving systems.

Enabling the Interconnect Technologies That Transform Our World: MKS’ Strategic Role in Powering the Future of AI and HPC

10/20/2026 | John T.C. Lee, with Won Lee, Marc Tricard, and Kuldip Johal
AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.

I-Connect007 Welcomes Michael Gleason as New Columnist

10/14/2026 | I-Connect007
I-Connect007 welcomes Michael Gleason, director of product development and strategic growth at GreenSource Fabrication, as its newest columnist. His monthly column, Built for What’s Next, will appear in I-Connect007 Magazine, offering a forward-looking perspective on PCB design, advanced manufacturing, and the technologies shaping the next generation of electronics. With more than 20 years of experience in PCB manufacturing, Gleason brings a combination of engineering expertise, operational leadership, and practical knowledge of advanced fabrication.
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