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At electronica 2026, Ventec International Group will present advanced material solutions for designers working at the boundaries of high-speed signal integrity, thermal management and physical space constraints. Experts from Ventec Giga will also be available to discuss PCB manufacturing equipment, factory planning and long-term manufacturing support.
At Hall A1, Booth 207, Ventec’s materials specialists will showcase the latest glass-free pro-bond and thermal-bond materials, highlighting how they can help reduce board thickness while delivering predictable performance and effective thermal management.
The team will also showcase ultra-low-loss prepregs and laminates for designers facing tight noise budgets in RF and microwave applications. Ventec’s tec-speed 30.0, with a dissipation factor (Df) as low as 0.00035 at 10 GHz, and tec-speed 20.0, with a Df of 0.0023 and a dielectric constant (Dk) of up to 10.2, offer material solutions for demanding high-frequency designs, helping minimise signal loss and preserve signal-to-noise ratio (SNR).
In addition, Ventec will highlight its FR4.1 and FR15.1 halogen free material ranges, which offer enhanced thermal and mechanical stability compared with conventional FR4 materials, alongside improved conductive anodic filament (CAF) resistance for demanding operating environments. The booth will also feature Ventec’s polyimide materials for applications requiring high reliability at elevated ambient temperatures.
Further highlights in Munich will include Ventec’s distribution portfolio, featuring ThinFlex adhesive-less, single- and double-sided flexible copper-clad laminates (FCCLs) and coverlays. Designed to support high-performance assemblies in compact or space-constrained applications, ThinFlex materials offer excellent reliability, fine-line etching capability, low moisture absorption and dimensional stability.
Ventec also distributes a broad range of products for PCB manufacturers, with solutions from leading brands featured at electronica. Visitors can explore how copper foils, thermal interface materials, drilling products, lamination accessories, press plates, and precision drills and routers can support PCB fabrication and help meet demanding production requirements.
Meet Ventec at electronica 2026
electronica 2026 takes place at Messe München, Munich, Germany, from 10–13 November 2026.
Visit Ventec at Booth 207, Hall A1 to meet the team and explore solutions for your next PCB design or manufacturing challenge.
