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Advanced Electronics Packaging Digest

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onsemi, Czech Ministry Agree to End SiC Expansion Project

11/09/2026 | onsemi
onsemi and the Czech Ministry of Industry and Trade confirmed that they will not proceed with the planned expansion to add end-to-end silicon carbide (SiC) production at onsemi's Rožnov pod Radhoštěm site, first announced in June 2024.

Qnity Showcases Next-Generation Electronics Solutions at electronica 2026

11/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase a portfolio of advanced materials and solutions designed to address growing thermal, power, connectivity and reliability demands across AI infrastructure, semiconductor manufacturing, automotive and high-performance computing applications at electronica 2026.

Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries

11/06/2026 | Applied Materials
 Applied Materials, Inc. announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares. The share purchase would add to Applied Materials’ current investment in Besi, which Applied initially made in April 2025.

Greene Tweed Recognized for Contributions to Korea’s Semiconductor Growth

11/05/2026 | Greene Tweed
The award recognizes the company's role in advancing Korea’s semiconductor market and continued investment in regional manufacturing

SEMI Reports 13.4% Growth in Q3 Silicon Wafer Shipments

11/05/2026 | SEMI
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.4% year-on-year to 3,756 million square inches (MSI) from the 3,313 MSI recorded during the same quarter of 2025.
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