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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

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Challenging Bright Students to Become Manufacturing Experts

11/11/2026 | Nolan Johnson, I-Connect007
SMTA’s Bright Manufacturing Challenge program is a post-secondary mechatronics competition spread over several months in which student teams are given a product specification with constraints; their finished product then competes with other teams in a live robot race at SMTA International. We spoke with Director Tara Dunn on the show floor about the competition.

Real Time with... SMTAI 2026: Koh Young's Advances in AI-Assisted Inspection and Customer Support

11/11/2026 | Real Time with...SMTAI
In this interview from SMTAI 2026, Joel Scutchfield discusses how Koh Young is expanding its Americas organization to support growth in AI, data centers, and other electronics markets. He describes AI-assisted programming, Smart Review, and automated feedback tools designed to reduce programming time, limit false calls, and improve production efficiency.

Arrow Electronics Launches New Business Capstone to increase Focus on IP&E Solutions

11/10/2026 | BUSINESS WIRE
Arrow Electronics, Inc. announced the launch of Capstone, a global business dedicated to interconnect, passive and electromechanical (IP&E) products, solutions and services.

Cadence Launches OrCAD Xplore to Accelerate Electronics Design Development

11/10/2026 | BUSINESS WIRE
Cadence announced the Cadence® OrCAD® Xplore Design Platform, a connected design environment that simplifies a fragmented component-to-design workflow, bringing research, trusted content, design, supply-chain intelligence and procurement together in one environment.

3 Key Takeaways: Why Advanced Materials Are Shaping the Future of Electronics

11/10/2026 | I-Connect007
The electronics industry is facing a new generation of engineering challenges. AI, advanced packaging, high-performance computing, and compact devices are pushing the limits of traditional design approaches. Engineers face mounting pressure to increase performance, manage rising power densities, and ensure reliability as electronic systems become smaller and more complex. In the companion guide, Engineering What’s Next, Qnity expands on the discussions featured in its six-part On the Line With… Qnity: Engineering What’s Next podcast series.
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