-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 1 minute
10 Common Stencil Questions
There are a wide range of stencils and stencil technologies available and many questions arise when the time comes to select one. This month’sThe Short Scoop answers the 10 most common questions our customers ask.
1. What type of stencil do I need?
The need to satisfy more rigorous printing requirements due to finer pitch components leads to a natural hierarchy of stencil technologies based on the application. A few general stencil technologies are available on the market today. They include stencils that are laser-cut on some form of stainless steel material, laser cut stencils on 100% nickel foils, and electroformed stencils for the most challenging applications. With each of these basic stencil types there are many coatings and post-process steps available to tailor the basic stencil further. The specific stencil types and options available are dependent on the supplier selected. Each of the key technologies and secondary processing options has its qualitative benefits for specific applications, and it is not uncommon in the industry today to see stencil users deploying a combination of all three stencil types in their factories. There are three main questions to ask and answer to help determine the correct stencil:
- What is the smallest pitch to be printed?
- What is the mix of components being placed on the board?
- What is the area ratio calculation of the smallest component?
Stencil users who optimize the correct stencil technology for their specific application and processing parameters typically enjoy greater yields and significantly lower rework. As always, it is about selecting the right tool for the job.
Read the full column here.
Editor's Note: This column originally appeared in the March 2014 issue of SMT Magazine.
More Columns from The Short Scoop
Adapting Stencils to Manufacturing Challenges in 2015The Short Scoop: Stencil Printing in PCB Cavities
The Short Scoop: Printing Two-level PCBs in One Step with a 3D Electroform Stencil
The Short Scoop: Improving Stencil Printing Results
The Short Scoop: More Stencil Questions (and the Answers!)
The Short Scoop: Selecting a Stencil Frame
The Short Scoop: Screen Printing Solutions for Small Die & Precision
The Short Scoop: 10 Common Stencil Questions