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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Fein-Lines: Copper Dissolution Interview, Part I
Dan Feinberg begins a series of interviews, with Michael Carano, Global Business Development Manager of Cleveland, Ohio-based OMG Electronic Chemicals, tackling the topic of copper dissolution with lead-free solder--an issue that is certainly not new to the industry.
Listen to "Fein-Lines: Copper Dissolution Interview, Part I" here.
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Fein-Lines: CES 2024—Reviewing the ‘Show’ Before the Show
Fein-Lines: Ramping up for CES 2024
Fein-Lines: The Road Less Traveled—Working From Home or the Office?
Fein-Lines: AI—Here and Changing the World
Fein-Lines: An Eye-Popping Eureka Park and ShowStoppers at CES 2023