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IPC APEX EXPO 2010: Exhibits Preview II
March 1, 2010 |Estimated reading time: 16 minutes
LAS VEGAS — IPC APEX is coming up April 6–9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes test systems from Acculogic, the Sentinel print inspection module from DEK, box build and stencil fab services from ITT, cleaning systems from Aqueous, a range of SMT equipment from Essemtec, halogen-free solder paste from Henkel, convection reflow from BTU, new soldering equipment modules from Pillarhouse, Assembléon’s new assembly line equipment, solder materials from Cobar, and closed-loop stencil cleaners from Smart Sonic. Over the next several weeks, SMT will bring you new product previews and highlights of the exhibit floor.
Not attending? Follow the IPC APEX stories from SMT throughout the show, on our Website www.smtonline.com and Twitter, www.twitter.com/surfacemount.
Latest Testing Technologies
Acculogic’s Manufacturing Test Systems Division will feature the latest testing technologies in its product offering. FLS 980Dxi Flying Scorpion is a patented double-sided, multi-probe (16) flying probe system with 3D probing and analog, digital and boundary scan test capability on all probes (top and bottom side). FLS 980Dxi uses closed-loop linear motor drives and joystick-like variable angle probe modules (0° to 6°) to maximize physical access and guarantee repeatable probing of fine-pitch devices and small components such as 0201 and 01005s. Using the patented vectorless test suite, PinScan, the FLS900 series detects open-pin and orientation faults on digital devices, polarized caps and connectors. The FiS640 compact in-circuit test system is a small-footprint ICT system that can be configured with up to 2048 all-real (non-multiplexed) channels, a high-accuracy analog measurement instrument, and patented Vectorless test techniques for detection of open pins on digital devices. It is available with a number of industry-standard fixture interfaces. It suits high- and medium-volume automotive, industrial, consumer, computer and communications electronics markets. System hardware is controlled by Acculogic’s Integrator worksheet-based software, supported by Acculogic’s XMATIC software suite. XMATIC is used to translate CAD designs, import bills of materials data, optimize data for selected manufacturing equipment, assign test probe locations, and output customized files. Test capabilities for the FiS640 include standard shorts and opens testing; analog value and analog function testing; Vectorless Opens testing using ChipScan and CScan; reduced-access boundary scan testing using Acculogic’s advanced ScanNavigator software; fast programming of on-board FLASH and ISP components; and combinational testing using optional off-the-shelf test instruments. The latest version of Acculogic’s ScanNavigator and Victory software offers full support for IEEE1149.6, an extension to the IEEE1149.1 standard. The new version of ScanNavigator has been extended to support the latest boundary-scan technology for the testing of high-speed buses and interfaces such as LVDS, Fiber Channel, Gigabit Ethernet and more. Acculogic’s ScanNavigator Integrated Boundary Scan Test and Programming Environment consists of test, programming and run-time modules that use Microsoft’s .NET technology and XML to simplify test generation, increase productivity, and allow full integration of test data, programming information, and diagnostic databases with Acculogic’s testability and coverage analysis tools. ScanNavigator architecture is optimized for data sharing and portability. Acculogic Ltd., www.acculogic.com, Booth 249.
DEK Features Sentinel Module
Sentinel is a print verification and process management technology that captures the full board image, analyzes the data and accepts or rejects the print in real time. The system also has the capability to manage printing inputs and outputs, as well as integrate verification and traceability tools. Designed to improve yield without impacting cycle time, Sentinel allows printing and high-speed inspection to run concurrently. The technology offers high-speed paste on pad and bridge detection and alignment capabilities, with vision coverage operating at 36,000 mm2/second performance. The intrinsic closed-loop control of Sentinel manages alignment, automatic understencil cleaning operations and paste dispensing to provide optimal process efficiency. It also rejects bad boards automatically without interrupting production. All of these features are managed through the intuitive touch-screen control of DEK’s Instinctiv V9 software. DEK International, www.dek.com, Booth 1573.
Returning to the Show: Metal Fab
Integrated Ideas & Technologies Inc. will be exhibiting at the IPC APEX EXPO, after being absent from exhibiting for the last few years. IIT will showcase their SMT Stencil Division as well as their rapidly growing Metal Fabrication Division. Their diverse range of products and design services provide solutions that increase post-reflow success of SMT components on the first pass, saving their customers valuable time and money. In 2005, the Metal Fabrication Division was added to IIT, Inc. to provide their clients with quick-turn enclosures and precision-machined metallic and non-metallic parts for box build assemblies. The recent expansion of this division has prompted the company to seek both ITAR and AS9100 registrations, allowing them to contract directly with the U.S Department of Defense. Integrated Ideas & Technologies, www.integratedideas.com, Booth 448.
Latest Cleaning Technologies
Aqueous Technologies Corp. will feature its Trident III and Trident Duo automatic defluxing and cleanliness testing systems, along with its Zero-Ion G3 and StencilWasher-ECO technologies. Trident III automatic defluxing and cleanliness testing is a lead-free-compatible, fully automatic post-reflow defluxing system. It is equipped with an automatic chemical injection system. The system features a closed-loop wash solution recycling system. Wash solution is heated automatically. Rinse water is sprayed onto the assemblies until the desired cleanliness level is achieved. All rinse water is directed through the pre-drain filtration system. Assemblies are dried via the on-board convection and radiant forced air drying system. Standard features include programmable maintenance reminders, remote SPC viewing, and SPC data export. An optional zero-discharge evaporation system eliminates connection to a drain line. The Trident Duo high-yield automatic defluxing and cleanliness testing system provides a cost-effective alternative to in-line defluxing systems, using between 0.5 and 2 gallons (1.8–7.5 liters) of deionized (DI) water per minute. The Trident Duo is equipped with two autonomous defluxing chambers. Each chamber is controlled by a dedicated computer controller and may be operated with different defluxing chemistries. Additionally, each defluxing chamber is equipped with independent cleanliness testing capabilities and recallable SPC data records. The Trident Duo is capable of high throughput levels and built-in cleanliness testing. Also on display at the show, the Zero-Ion g3 Ionic Contamination (Cleanliness) Tester is designed to test electronics assemblies for ionic contamination. It automatically removes and detects contamination on an electrical assembly or bare board and provides quantitative contamination measurements. The Zero-Ion g3 provides automatic regeneration of test solution, maintaining a high degree of test solution sensitivity. It meets the requirements of military and commercial cleanliness testing standards including MIL 2000A, IPC test method 001, MIL-C-28809, MIL-P-55110 and IPC TM650-2.3.26. The Zero-Ion has been reviewed by the U.S. Naval Air Weapons Center and determined to be the most sensitive ionic contamination tester available. The Zero-Ion also has been determined to be 3.7× more sensitive than the manual resistivity of solvent extract (ROSE) test. The Zero-Ion performs cleanliness tests automatically and features a Windows PC-based control platform with a 15" LCD touchscreen interface. The StencilWasher-ECO Ultrasonic Cleaning system also will be exhibited and provides fast, efficient, economical solder paste removal. The ultrasonic cleaner is designed to remove all solder paste types including no-clean, rosin, and water soluble. It performs thorough wash, rinse, dry, and filtration functions, including powered and filtered wash and rinse tank drain systems. An adjustable wash cycle timer automatically controls the wash tank's immersion transducers. A handheld rinse wand and airknife are standard. Aqueous Technologies, www.aqueoustech.com, Booth 725.
Range of New SMD Placement Equipment, Printers, and Reflow Ovens
Essemtec will feature a range of new equipment at the show. Essemtec’s Tower is an automatic storage system for SMD reels and trays. The SMD Tower delivers up to 546 SMD reels or trays and requires 8-12 seconds to dispense any component required. The Tower is recommended in low- or high-volume production and with frequent change-overs. The storage system can be expanded with additional Towers. The convenient control software supervises the stock and ensures first in first out useage. Each component can be assigned to a moisture class (IPC standard 033A), and the allowable operation time in a wet surrounding is controlled. Paraquda from Essemtec is a modern SMD pick-and-place machine with high-quality materials and a new high-speed control system. The Paraquda features short changeover times, intuitive operation system Eplace, and an integrated quality management system. It has up to 210 feeders capacity. Paraquda's pick-and-place head can simultaneously hold and measure four components. The range of components spans from 01005 resistors up to 4 x 4″ components, which can be up to 1 inch in height. The minimum pitch is specified with 0.01″. The high-resolution fly-by vision system is equipped with the latest Cognex SMD image processing technology, detecting even odd-shaped parts. Also at the show, the SP900 in-line printer is a fully automatic in-line printer for high-mix/high-speed production. The printer is designed for multi-shift operation with minimumal service. The integrated stencil cleaner is programmable, and closed ball rotation spindles drive the maintenance-free print head. All moveable parts are protected against dirt. It handles board thickness from 0.01 to 0.2″ with automatic stencil entry and alignment, and automatic width adjustment. Also, the system can accommodate stencils or screens up to 29 × 29″. Essemtec will also exhibit RO400FC, which features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for process evaluation and process control for reflow ovens. This software offers many of the same features as thermal profilers, integrated into the oven. The universal mesh belt or the optional precise chain conveyor transports single- or double-sided boards up to 16″ wide. Other benefits include a full convection oven for even temperature distribution, high air volume for low thermal stress of components, vertical laminar flow for efficient heat transfer, closed-loop conveyor drive system for controlled speed, easy profile selection and an optional flying thermocouple for temperature profiling. RO400FC with RO-CONTROL software is for standard or lead-free soldering, features an integrated microprocessor control or computer control option, an optional SMEMA interface, ESSEMTEC RO-SOFT profiling software, and built-in security switches. The RO300FC-C is a full convection oven that allows fast and homogenous heating, as well as high-temperature soldering of sensitive electronics. The integrated convection technology offers a vertical hot air stream that evenly heats the complete PCB. Standard and lead-free pastes can be used. RO300FC-C now features RO-CONTROL software for increased process simulation and control. The EXPERT-SAFP placement system will be at APEX as well. It suits prototyping because it allows components to be picked from both reels and sticks, and from rest tape strips as well as loose. A turning station for upside-down components comes standard. The EXPERT placement system can be connected with computer controls and worked in a semiautomatic mode. Placement data can be converted directly from the CAD file or through point by point. The EXPERT placement system is available as a complete prototyping station, including a dispenser and a reflow tool. The placement system PANTERA-X suits high-mix/low-volume production. The large feeder capacity and the automatic identification of the intelligent feeders minimize changeover time. All tape feeders are electrically driven and feeding pitch is programmable. The tabletop printer SP004 is a new printing system. Vision cameras are equipped with laser pointers and fast clamping systems. Changeover takes just a few minutes. The SP004 allows printing with 15 µm accuracy. Essemtec, www.essemtec.com, Booth 1059.
Halogen-free Solder Paste
Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen. The material has zero intentionally added halogens and is under the limit of detection in the rigorous oxygen bomb/ion chromatography test. Formulated for low voiding in fine-pitch CSPs and BGAs and solderability over a wide range of reflow profiles in air and nitrogen, Multicore HF108 has proven capability on a variety of surface finishes including immersion silver and OSP copper. The material’s process flexibility accomodates environmental variations: the humidity resistance of Multicore HF108 is superb and has exhibited excellent coalescence even after eight hours of exposure to 80% relative humidity (RH). Other attributes include colorless residues for easier inspection and hot slump resistance, which limits the risk of bridging. Henkel Corporation, www.henkel.com/electronics, Booth 2159.
Convection Reflow
BTU International (Nasdaq: BTUI) will feature the Pyramax 100N convection reflow oven. The Pyramax 100N features 100″ heated length and eight zones, 350ºC maximum temperature, flexible platform configuration, low power and gas consumption, and a comprehensive menu of options. The oven provides excellent thermal uniformity through closed-loop convection control and suits lead-free applications. Pyramax 100N features user-friendly Windows-based WINCON oven control software, parts-identification software, a wide range of options, as well as a comprehensive warranty. BTU International, www.btu.com, Booth 7121.
New Soldering Technologies
Pillarhouse will launch the Synchrodex Fluxer and Preheat combination module at IPC APEX. The fluxing operation can be performed by either the dropjet or ultrasonic application process. After the fluxing operation is complete, the IR preheater automatically heats the board to the set parameters. Preheating can be used from above and/or below and convection (using one, two or all three of these options). The bottom and topside IR preheating systems can also be monitored by closed loop systems for ease of set-up and use. Benefits of the system include smaller line footprints, faster throughput and added flexibility. With the successful release of the Jade Handex system in 2009, Pillarhouse will now release the patented sliding Bottom-side IR preheat for the Jade Handex. This new slide in/out bottom-side IR preheat system is controlled via the Pillarcomm software or the optional closed loop sensor systems. With the addition of the bottom-side unit, the Handex is now configurable with top and bottom IR heater to help process thermally challenging boards. Pillarhouse will introduce the patterned multi-directional rotating Jetwave solder nozzle system as well. Since the presentation of the moving solder bath systems, the pattern Jetwave solder nozzle technology has only been able to be used in single direction. This Jetwave solder nozzle rotation system now enables the machine to solder connectors that are positioned in any direction on a PCB without intervention. Pillarhouse USA Inc., www.pillarhouseusa.com, Booth 2149.
Production Line Improvements
Assembléon is introducing the cost-effective MC-24X, a versatile extension to the company’s end-of-line solutions for high-volume and high-mix production lines. In addition, there is a new all-in-one solution for small and medium batch sizes with a high product mix: the MG-5 with thin 8-mm feeders that allow 30% more feeders on the same floorspace. Also on display is Assembléon’s MCP screen printer, with low defects per million (dpm) figures and a board cycle time, including board transport, down to 11 seconds. The MCP complements A-Series pick-and-place machines. The A-Series itself now takes boards 800 mm long by 457 mm wide for industrial applications that are key in the U.S. The A-Series (which includes the AX-301, shown at APEX) also solves the problem of production fluctuations, with Assembléon’s True Capacity on Demand. This allows customers to temporarily rent and install extra pick-and-place robot heads to meet peaks in demand. There is no change to the equipment footprint, and calibration-free robot heads are quickly and easily fitted to the machines on the line without changing vulnerable internal hardware. The A-Series has half the energy consumption of competing machines. Also new is a tray trolley on the AX-201 end-of-line machine that doubles the speed of feeding. On show for the first time is the MC-24X full-featured dual-sided pick & place machine, which packs up to 96 intelligent feeders in just two and a half square meters (27 sq.ft.) of floor space. With its top speed of 54,000 components per hour, it is a high-speed end-of-line addition to Assembléon’s end of line solutions. The machine places components from 0.4 by 0.2 mm (01005) up to 45 mm square on boards up to 700 by 460 mm. Aiming at the entry level market, also at the show is the MG-5 all-in-one modular pick-and-place machine, which speeds CAD data to first product production. It handles large boards and odd-size components, and has 106 fixed feeder positions. At highest speed, the machine places up to 20,000 components/hour. The MG-5 is compact, and has simple machine set ups with rapid changeovers. The company’s MCP printer has a board cycle time down to 11 seconds, and handles a wide mix of components down to 01005 chips, component interspacings down to 80 µm and works on PCBs and flex circuits. The single swing squeegee head design uses variable attack angle printing. This gives consistently flat and uniform solder deposits, even on boards that mix large and small components. Additional, stable print quality can be controlled by an optional closed-loop control paste inspection camera, which will search for known printing defects, and can automatically adjust printing parameters or initiate stencil cleaning when necessary. The A-Series is also seeing continual improvements, with the machines now taking extra-long and extra-wide boards, essential for many industrial applications. Royal Philips Electronics subsidiary Assembléon, www.assembleon.com, Booth 325.
New Solder Materials
The Balver Zinn Group announces that Cobar Europe BV will introduce its new Aquasol branded water-soluble solder paste. Aquasol can be used with any common soldering alloy. SnPb and lead-free SAC and SN100C versions are available, all exhibiting excellent performance in printing (including fine-pitch capability), placement, reflow and cleaning. Due to a balance of adhesive and cohesive forces, there is efficient separation from the squeegee and good aperture release with long stencil life. The rosin nature of this water-soluble paste has paste rheology, solderability and water washability conferred by select surface chemistry and activators. With Aquasol paste, it is possible to print at speeds high enough to meet or exceed the throughput of the SMD line. Furthermore, the paste features excellent slump resistance and residues can be removed with de-ionized water. The paste’s extended tack time allows a longer period between printing and placement. Additionally, the high tack force holds components in place during transportation prior to soldering. With Aquasol, voiding is minimized in air and nitrogen processes. Post-soldering flux residue can be removed using hot deionized water with or without cleaning agents. The ideal temperature and water pressure depend on the complexity of the assembly and efficiency of the wash method and equipment. Furthermore, Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to solder paste to high-performance fluxes at APEX 2010. Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group, www.cobar.com, Booth 1876.
Closed-loop Stencil Cleaners
Smart Sonic will introduce the EnviroGuard 100% closed-loop stencil cleaner at IPC APEX. EnviroGuard is an aqueous stencil cleaner able to clean all types of solder paste with a 100% closed-loop process for wash and rinse. Smart Sonic matched the unique properties of its 440-R SMT Detergent to a specifically designed filtration/UV system that facilitates 100% closed-looping and zero VOCs of both the wash and rinse solutions. Normal operation requires the filters to be changed quarterly at a cost of approximately $300 per maintenance cycle. The liquid hazardous waste never exits the system. 99% of the waste solder paste from stencils and misprinted PCBs is captured for easy recycling; the remaining 1% is removed by the EnviroGuard filtration system for a completely contained and environmentally benign cleaning process. Users can return the spent filters to Smart Sonic for regeneration and reuse. Like a wastewater evaporator, the EnviroGuard filtration system is zero discharge with no venting requirements, easier maintenance, and all water reused rather than released to the atmosphere. The EnviroGuard system is available on all Smart Sonic Stencil Cleaners and will eliminate the need of a wastewater evaporator. Smart Sonic Stencil Cleaning Systems, www.SmartSonic.com, Booth 1771.
Read More IPC APEX 2010 Exhibit Previews:IPC APEX EXPO 2010: Exhibits Preview I
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