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ADHESIVES/COATINGS/ENCAPSULANTS/UNDERFILLS
December 31, 1969 |Estimated reading time: 13 minutes
Epoxy Corner Underfill
Loctite 3508 is a one-component epoxy pre-applied to the PCB at the CSP pad corners using a standard dispensing system. Unlike capillary flow underfills, it can be applied in-line with cure during normal solder reflow. Loctite 3508 targets cost-effective solutions for mobile products experiencing occasional vibration. When non-optimized adhesives (materials that have not been formulated for use as corner underfills) are used as corner support materials, self centering does not occur, thus resulting in poor interconnections and solder joint opens and fractures that may cause decreased reliability or total device failure. This material is lead-free compatible, adaptable to in-line processing, and enables total ball collapse and the self-alignment properties necessary to compensate for slight component-to-pad misalignment during device placement. A reworkable underfill material, it optimizes resources with expensive assemblies. The product boasts a pot life of greater than 30 days, standard refrigerated storage, and stability at room temperature. Henkel Corporation, Irvine, Calif., www.henkel.com/electronics.
ASSEMBLY TOOLSSlic-Blade Squeegee Blades
The Slic-Blade surface is smooth and slick, eliminating solder paste sticking to the blade. There is less bridging, reduced paste shear breakdown, and faster print speeds when using this product. Smooth, low-surface-energy electroformed blades with a precision-ground, sharp edge create ideal printing environments. The Slic-Blade is solid nickel, and will not chip or flake as coated blades do. This allows the Slic-Blade to be re-sharpened when it becomes dull, lowering cost of ownership. Lessened bridging is due to reduced flux bleeding. Squeegee blade sharpness and angle of attack are significant factors that influence the printing speed of solder paste. Due to the sharpness of the squeegee blade, less pressure is required to wipe the stencil thoroughly, resulting in faster printing. The Slic Blade has enhanced stencil life and the least stencil damage compared to competitors, resulting in the longest stencil life. Longer stencil life reduces cost and amount of scrap. Little changeover is needed. Fine Line Stencil, Greeley, Colo., www.fctassembly.com.
CLEANINGSolvent for Lead-free
PowerClean II is a solvent engineered specifically for the rework and repair of lead-free PCBs. PowerClean easily flushes away lead-free fluxes and paste residues, plus oils, inks, and conformal coatings, but most uniquely it accomplishes these chores without creating white residue. Indeed, the hidden innovation of PowerClean is not only does it remove pesky white residues caused by other solvents, it actually prevents the formation of those residues. Technicians prefer its effortless, aroma-free cleaning. Health-and-safety knows nonflammable solvents are safer, and PowerClean is possibly the strongest benchtop solvent not based on ingredients like trichloroethylene, methylene chloride, or nPB. It also features good toxicity ratings, low global-warming-causing contents, and is ozone-safe. PowerClean is ounce-for-ounce the least expensive product in its class. MicroCare Corporation, New Britain, Conn., www.microcare.com
CONTRACT SERVICESConcept to Completion Contract EMS
SenDEC sets itself apart from competitors by not merely building to a specification, but evaluating each assembly at quote and offering detailed design for manufacturability, assembly, and test feedback based on SenDEC’s 30 years of expertise. If implemented, this feedback will lower the assembly’s total lifecycle cost by streamlining production, improving yields, and minimizing the potential for field failures. This mentality starts with board layout and carries through to final assembly production. Besides providing invaluable DfM/DfA/DfT suggestions, SenDEC has the ability to quick-turn prototypes with its 24 prototype specialists; all IPC-610-A Class III certified. This group serves as a vital link between the customers’ engineering teams and SenDEC’s production department. Augmenting these value-added services, SenDEC is dedicated to creating customer value through a commitment to excellence including: a continuous investment in state-of-the-art equipment, processes, and employee training; dedicated program management; locally managed distributor warehouses; flexible logistics program; and an understanding that quality and customer Service are not departments, but a philosophy. For these reasons, SenDEC has maintained consistent growth and received recognition both regionally and nationally. SenDEC Corporation, Fairport, N.Y., www.sendec.com.
DESIGN AND MANUFACTURING SOFTWAREEnvironmental Compliance Design & Management Software
The GoodBye Chain Group’s product compliance management software, MDW, has been a leading software solution for SMT companies needing to comply with all global RoHS directives and their customer-driven toxicity requirements. Companies now can use MDW-EcoSolution (MDW-ES) to comply cost-effectively with REACH’s voluminous legal and business requirements, including minimizing the supply chain/business disruptions expected to occur under REACH. MDW-ES allows companies to: 1. immediately build their own internal REACH-ready substance libraries; 2. identify substances that are operationally critical to both their products and manufacturing processes; 3. highlight and find substitutes for any of the likely 1,500 substances of very high concern that will be restricted or banned by legislation; 4. store in one central location MSDS forms, testing reports, and other REACH-related documents; 5. track volumes, substance applications, and other substance-related data points needed for proving REACH compliance. The GoodBye Chain Group, Colorado Springs, Colo., www.goodbyechain.com.
DEVICE PROGRAMMINGFlash Programming System
The four-socket Flashstream Vector programming system offers programming of NAND and NOR flash memory at 2.5% over theoretical programming minimum, due to Vector Engine proprietary coprocessor. This technology hardware-accelerates flash memory waveforms during the programming cycle. Synchronous operations eliminate dead times. The Flashstream programs devices up to 32 Gbit and has upgradeable RAM for future densities. It comes with 4191 Mbit/site. The programmer includes bad block replacement scheme for NAND and low voltage support. Multiple units can be connected to one computer to run the same programming job in concurrent programming mode. Single units can be mechanically connected. An LED display identifies programmer number corresponding to software. It includes active, pass, and fail LED status indicators on each socket card, as well as Auto-start on continuity check. It enables new applications, especially for very large patterns. The system’s speed reduces labor costs as well as the number of machines needed to perform the same function. It can program lead-free devices. BPM Microsystems, Houston, Texas, www.bpmmicro.com.
DISPENSING EQUIPMENTJetting Alternative
Camalot’s SmartStream non-contact dispense pump technology offers a cost-effective, accurate, and easily maintained alternative to jetting. This new, innovative system features Streaming, a patent-pending technology whereby material is dispensed in a narrow column, rather than a single sphere. Well-suited to underfill applications, SmartStream eliminates needle use and incorporates positive displacement of the dispensed material with a piston and barrel combination. Piston control via closed-loop servo drive achieves high accuracy and repeatability for consistent results. Durability, ease of maintenance, and low cost of ownership were design drivers. Unlike other methods, SmartStream does not strike the nozzle/seat with the piston, so internal wear is greatly reduced and operation is quieter. An industrial sapphire insert resists nozzle abrasion from dispensed materials. The fluidic module is separate from the pump and easily removed without special tools. Routine maintenance is minimal and low-cost. SmartStream is field-retrofittable and compatible with current options. Speedline Technologies, Franklin, Mass., www.speedlinetech.com.
ENVIRONMENTALLY FRIENDLYSolder Recovery System
The EVS 1000 solder recovery system is a smaller system that converts waste dross into reusable pure solder and lead-free solders in minutes. The smaller size and footprint help reduce cost, and provide 10-lb. capacity for dross. The system meets global recycling standards and is 14001-compliant. Dedrossing times are 50?75% lower. It provides a cleaner wave with less maintenance and repairability, less downtime, and a reduction in shorts and bridging. It also circumvents use of messy wave oils and/or dross reduction powders. The EVS 1000 is aimed at small- to medium-size users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. By using the EVS, nitrogen can be eliminated, resulting in significant cost savings. Also, by recovering the solder by 80?90%, this saves the amount of solder which the manufacturer will have to purchase. EVS International, Isle of Wight, U.K., www.evsinternational.com.
INSPECTIONCombination AOI and 3D X-ray Inspection System
The Viscom X7056 is the first combination AOI/AXI system to offer simultaneous top- and bottom-side optical inspection along with parallel 3D X-ray inspection. An innovative dual-conveyor gantry system allows parallel inspection of two boards simultaneously, dramatically reducing cycle times. This allows a single X7056 to do the job of two separate machines, providing throughput rates up to 50% higher than conventional systems, yet at significantly lower operating costs and with less use of valuable factory floor space. Two high-resolution, 15-megapixel optical sensors enable top and bottom inspection of components as small as 01005 and pitches down to 0.3 mm, even at maximum inspection speeds. In addition, a proprietary Viscom high-performance microfocus X-ray tube and iterative 3-D modeling software give the X7056 highly accurate X-ray image quality, with a resolution of 15 µm per pixel, enabling the X7056 to resolve complicated overlaps on double-sided PCBs and generate easy-to-analyze features. Viscom Inc., Duluth, Ga., www.viscom.com.
PACKAGESSolderball Pin Technology
Solderball Pin technology uses a high-performance conductive copper interconnect that incorporates a solder ball interface to the host PCB. The Solderball Pin provides additional solder and allows the subassembly to drop and align during reflow. These attributes compensate for PCB coplanarity variances of up to 0.020” between board-to-board mezzanine stacking designs. The inherent design flexibility allows designers of PCB-based modules to determine optimal pattern and positioning of individual interconnects, thereby maintaining design and layout consistency between new SMT versions and thru-hole legacy versions. Solderball Pin technology is the preferred cost-effective SMT interconnection method in point-of-load (POL) power applications of major DC/DC conversion power electronics OEMs. Solderball Pin technology’s compact configuration and flexibility as a discrete SMT component facilitates adoption into a broad scope of different applications: electronic lighting controls, remote telemetry monitoring, Ethernet, fiber channel, storage area networks, automotive, and many other daughter-to-motherboard module-based subassemblies. Autosplice Inc., San Diego, Calif., www.autosplice.com.
PICK-AND-PLACEFlexible Modular Mounter
Hitachi’s latest-generation GXH-3 flexible modular mounter is rated at placing 95,000 CPH. The heart of the GXH’s technology comes from its patented “Direct Drive” flexible high-speed heads with a component range of 0201/01005 through 44 × 44 mm. The GXH-3 also incorporates cutting-edge technology for optimal placement. Using an independent CCD line sensor for each head, the GXH-3 does a component thickness measurement of each part and automatically adjusts for any variance. The new laser height verification system measures programmed points on each board to detect warpage. Couple that information with the line sensor feedback to offer exact Z placement. Future technologies built into the system include the ability to flawlessly place PoP devices via Hitachi’s fluxing module. Component feeding options include the ability to install 200 different taped 8-mm devices on the GXH at one time, three different tray feeding options, vibratory stick feeders, and quick bankfeeder change carts. Hitachi High Technologies America, Schaumburg, Ill., www.hitachi-hta.com.
PRINTINGScreen Printing with Integrated AOI
The VERSAPRINT printer uses a patent-pending, revolutionary Line Scan Technology (LIST) camera and the Triple Rail Transport (TRT) for true time savings via optimized parallel processing and 100% post-print AOI integrated into the machine with a minimum floor space requirement. ERSA revolutionizes the printing and post-print AOI processes via the use of a line-sensor-based camera for both alignment and inspection. The LIST camera has top and bottom contact image sensors and an array of rod lenses designed for this application. It achieves inspection speeds of 9,100 mm2/sec., and scans the entire substrate, offering many operator advantages. The two most time-consuming processes of printing and inspection can run parallel for cycle time savings. A complete machine (post-print AOI) can be saved at no loss of functionality. The VERSAPRINT with integrated 100% inspection identifies problems early in the process to guarantee quality without additional capital investment. The graphical user interface (GUI) is designed according to SEMI Standard E95-1101, a common software interface. ERSA GmbH, Baden-Württenberg, Germany, www.ersa.de.
PROCESS CONTROL SOFTWARELean Software System
Optel software system manages the PCB manufacturing process, implementing lean manufacturing best practices for increased agility, throughput, and quality, while reducing cost and setup times. Optel’s proprietary algorithms deliver at least 5% more throughput on SMT machines than other programs, reducing cycle time and delivering better asset use. It makes high-mix/low-volume assembly efficient and profitable; all aspects of the process are automated and optimized wherever possible, eliminating non-value-adding activities and minimizing machine downtime. Routing instructions and line and machine setup documents are automatically generated. Manual assembly, box build, and rework support close a gap for component-level traceability: components manually installed or replaced at a rework station are captured and stored to the central database to maintain product integrity, ensuring quality. Optel supports efficient hot-job handling, providing quick and easy rescheduling capabilities to quickly react to production disruptions and emergencies. The system comprises a full suite of modules all integrated by a single global database. Optimal Electronics Corporation, Austin, Texas, www.optelco.com.
REWORK AND REPAIRAdvanced Rework Station
The VJ Electronix Summit 2200 is engineered for demanding lead-free processes. It includes automated site prep (scavenging), automatic and vision-assisted placement, wide area profile storage compatibility, bottom heater and motorized table, and integrated technical documentation. This system allows fully automatic component removal, non-contact site prep, and placement of components with minimum intervention. Integrating site prep into pick-and-place results in less thermal cycling, faster cycle times, and higher yields. The automatic placement system facilitates placing high-lead-count components. Using advanced network software, it enables central storage of processes and profiles. During runtime, it checks for the most updated profile and downloads the latest process file on demand or automatically, allowing a central process lab to maintain and distribute data globally. It incorporates a 4.0- or 5.6-kW bottom heater for lead-free. The bottom heater’s cooling boost decreases cycle times and meets maximum TAL constraints. Manual with visual assist suits difficult-to-align components. Manuals, help files, etc., are embedded in the SierraMate 7.0 application software. VJ Electronix, Littleton, Mass., www.vjt.com.
SOLDERING EQUIPMENTSolder Recovery System
The EVS 1000 solder recovery system is a smaller system that converts waste dross into reusable pure solder and lead-free solders in minutes. The smaller size and footprint help reduce cost, and provide 10-lb. capacity of dross. The system meets global recycling standards and is 14001-compliant. Dedrossing times are 50?75% lower. It provides a cleaner wave with less maintenance and repairability, less downtime, and a reduction in shorts and bridging. It also circumvents use of messy wave oils and/or dross reduction powders. The EVS 1000 is aimed at small- to medium-size users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. By using the EVS, nitrogen can be eliminated, resulting in significant cost savings. Also, by recovering the solder by 80?90% this saves the amount of solder which the manufacturer will have to purchase. EVS International, Isle of Wight, U.K., www.evsinternational.com.
SOLDERING MATERIALSAir-reflow No-clean Lead-free Solder Paste
As CSP, 0201, and 01005 technology is becoming more mainstream, PCB assemblers are challenged with achieving high solder paste transfer efficiency through small stencil apertures. Indium8.9 was formulated to produce consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66, and print perfectly every time. From cell phones to mother boards – Indium8.9 does it all. Indium8.9 exhibits low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology. It also offers a very robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements. Indium8.9 was specially designed to be extremely thermally stable and maintain a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing. The performance benefits customers obtain by using Indium8.9 result in increased cost savings and the highest finished goods reliability. Indium Corporation, Clinton, N.Y., www.indium.com.
TESTINGCleanliness Tester
The C3 evaluates specific areas of circuitry or sensitive components that could hold concentrated pockets of contamination. Its critical cleanliness control (C3) ionic cleanliness tester examines a 0.1 inch2 area and provides immediate cleanliness feedback. Target tests include components or circuits particularly sensitive and prone to performance issues. Presence of conductive or corrosive residues can be detected quickly and effectively, speeding up test. When further analysis is needed, users can send collected samples for testing. The system produces a microburst of steam that is allowed to soak for 20 sec. then is aspirated into a collection cell. This deionized steam extraction system collects 2.2-mls samples. This steam is applied eight times to achieve effective residue removal. After nine collection cycles, an electrical test is performed across a sacrificial y-pattern electrode to check for electrical leakage. Extracted samples can be used for ion chromatography analysis to determine the type and quantity of contamination. Aqueous Technologies Corp., Rancho Cucamonga, Calif., www.aqueoustech.com.