The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Estimated reading time: Less than a minute
June 11, 2013
Tin Whiskers: Clarity First
Concerns over tin whiskers have intensified in recent years. Various research and studies have delivered burgeoning reports and have appeared in industry publications. The tin whisker issue, and its potential mishaps, has been recognized for more than six decades in electronic, electrical, and industrial applications. So, what is new?
This series will address the practical and pragmatic aspects of the tin whisker phenomenon with a light touch on scientific background. Before I delve into the gist of tin whiskers, several areas should first be clarified.
Read the full column here.
Editor's Note: This column originally appeared in the May 2013 issue of SMT Magazine.
Share on:
More Columns from SMT Perspectives and Prospects
SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation ModelsSMT Perspectives and Prospects: A Dose of Wisdom
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
SMT Perspectives and Prospects: Critical Materials—A Compelling Case, Part 3
SMT Prospects and Perspectives: AI—A Prelude to Opportunities, Challenges and Possibilities
SMT Perspectives and Prospects: Pearls of Wisdom
SMT Perspectives and Prospects: The Role of Bismuth (Bi) in Electronics, Part 7: A Case Study in Fillet-Lifting
SMT Perspectives & Prospects: Creating a Better World Through Engineering
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in