-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
New Products
December 31, 1969 |Estimated reading time: 8 minutes
BGA Rework Station
Designed for both lead-free and standard solder, RD-500SH is a vision-based semiautomated reflow, removal and placement rework station for all printed circuit assemblies, including connectors. The station is said to combine high-powered top and bottom heaters with an advanced auto-profiling technology to efficiently heat and reflow the most demanding rework applications. The system also uses a combination of dark IR and localized hot gas heating technology to deliver optimal temperature and time profiles for even thick boards and area array packages with an I/O count more than 40 mm. The station can handle boards up to 400 × 420 mm using a standard board fixture, as well as boards much larger or smaller, using optional or custom board holders. FocalSpot, San Diego, Calif.
Placement Range Expansion
The 4797R HSP high-speed placement platform is said to be the result of a trimmed footprint and increased maximum board size. Creating more flexibility in a smaller shop floor space, the system reportedly accepts up to 96 feeders and maintains placement speeds of 48,000 cph. The system can handle boards up to 610 × 460 mm (24 × 18") in a footprint measuring 3,100 mm (122") long and 2,155 mm (84.8") deep. Additionally, the machine is said to emphasize placement accuracy. Three-sigma accuracy is 0.08 mm for MELFs and small chips, and 0.05 mm for leaded components. Universal Instruments Corp., Binghamton, N.Y.
UV Laser Machine
Microbeam 3205 UV laser machine is said to be based on a single-laser concept, as well as provide a 30 percent performance increase over the company's previous model. With respect to maintenance costs, the system reportedly is better than established dual-head systems with two separate lasers. Microbeam drills the small holes necessary to interconnect one electrical circuit layer to a deeper-lying circuitry. Additionally, the machine uses state-of-the-art laser technology with a deflection unit control system. The technology the machine is based on produces higher peak powers, minimizing the thermal load on the substrate and resulting in higher processing quality, especially in fiber-reinforced materials. Siemens Dematic AG, Nuremberg, Germany.
Aqueous Cleaning Systems
CBW OmniJet aqueous cleaning systems for the electronics assembly, surface mount and semiconductor packaging industries reportedly feature all-stainless steel construction for longer service life, lower maintenance, chemical compatibility and high heat capability. The system is said to use a unique high-temperature/high-flow air-drying technology, which reportedly is unachievable in units of plastic design that removes and evaporates water from even the most dense, complex electronics assemblies. The system's high-process efficiency results in higher throughput from the user's existing cleaners, no longer limited by dryer inefficiency. Stoelting, Kiel, Wis.
DISPENSING EQUIPMENT
Dispensing Enhancement Kit
Micro dispensing enhancement kit is said to be for fast, efficient repair or upgrade of existing valves. The kit offers a solution to worn or outmoded dispensing valves and an alternative to off-site repairs or complete valve replacement. Additionally, the kit comes standard with a cartridge, pump body with adapter for the existing motor, pump mount and needles. Available in one unit, the kit reportedly integrates with the motor portion of existing units, and features a compliant Z-axis for use with footed dispense needles. DL Technology LLC, Haverhill, Mass.
Pump
With a design that reportedly reduces materials costs, facilitates quick changeovers and expands the range of useable materials, MPM's next-generation pump technology can be used with various materials, including solder pastes, adhesives and certain fluxes. The pump is said to represent a new approach to paste management, featuring a smaller paste chamber that reduces material waste and compacting, as well as disposable inserts for simplified cleaning and reduced maintenance downtime. Additionally, improvements in product yield are achieved through proximity membrane sensing and direct pressure control to enable accurate material deposition, especially for paste-in-hole applications. Speedline Technologies Inc., Franklin, Mass.
Jet Dispenser
DispenseJet DJ-9000 jet is for high-speed delivery of numerous fluids, including underfill, surface mount adhesive, encapsulants, conformal coatings, UV adhesives and silver epoxies. The dispenser reportedly is faster, easier to clean and delivers capabilities necessary for advanced production requirements. The system is for stacked die and densely packed boards, and can jet in spaces as small as 200 micrometers. Additionally, it is said to create fillet wet-out widths as small as 300 micrometers on the dispensed die side. Dispensing fluid as discrete dots or a rapid succession of dots to form a 100-µm diameter stream of fluid from the nozzle, the jetting is said to break through many traditional needle dispensing barriers. Asymtek, Carlsbad, Calif.
Nylon Cartridges
This company introduces the availability of nylon cartridges for its MIXPAC handheld cartridge dispensing system for two-component adhesives. These cartridges reportedly are for use with chemistries not compatible with traditional polypropylene cartridges. The nylon cartridge dispensing system features a 50 ml capability and is used to dispense two-component adhesives in various ratios, including 1:1, 2:1, 4:1 and 10:1. Additionally, the cartridges are available in a 200 ml capacity with a 1:1 volumetric dispensing ratio as well as the 400 ml system with volumetric ratios of 1:1 and 10:1. The cartridge system is said to consist of a manual or pneumatic dispensing gun, a cartridge, and a static mixer, all designed to work as a system. ConProTec Inc., Salem, N.H.
INSPECTION EQUIPMENT
Large-view Inspection Area
TIGER X-ray inspection system now features an extended oblique view inspection area (OVIA) for 24 × 24" boards. The enlarged capabilities reportedly allow operators to inspect up to 24 × 20" at full oblique angles and highest magnification. A large viewing area is key to high-magnification X-ray inspection of large boards because it is said to enable even the edges of the board to be inspected with full tilt and rotate parameters. Additionally, it allows users to view a set of smaller samples spread over the entire sample tray. FEINFOCUS, Stamford, Conn.
Microfocus X-ray
Kevex PXS5-927, a 90 kV line of microfocus X-ray sources, is said to build on the company's integrated X-ray source innovations by integrating the complete X-ray source — tube, power supply and control unit — in one compact package. Additionally, the system is said to provide image resolution of less than 4 µm focal spot, high magnification, and strong focal spot location and X-ray flux stability for microfocus X-ray inspection, high-performance micro CT and other nondestructive test applications. Thermo Electron Corp., Scotts Valley, Calif.
PICK-AND-PLACE
Benchtop Pick-and-Place System
LE20 and LE40 benchtop automatic pick-and-place systems are said to accurately place virtually all SMT components, including discretes, SOICs, PLCCs, QFPs and BGAs from interchangeable tape, tube, bulk or tray feeders. These low-cost but sophisticated systems accommodate up to 64 feeder positions and boards up to 13.5 × 22". By using the latest Pentium PC with Windows-based software, the machines are easy to program and operate. The systems feature placement rates up to 3,000 cph, and options include digital glass scale encoders for ultra-fine-pitch and 0201 placement, touchless laser centering vision, CAD editor software, and a fluid dispenser. Automated Production Systems Inc., Huntingdon Valley, Pa.
Twin Tape Feeder
Twin tape feeder features a feeder design based on dual tape single slot (DTSS) technology, enabling implementation of high-density 8 mm SMD tape component part numbers. The new feeder technology is said to support lean manufacturing by enabling users to fulfill their placement requirements with high output on a small footprint. The availability of additional lanes improves component balancing, further reducing cycle times. Expanded feeder capacity provides opportunities for family setup, with faster changeovers adding to efficiency and cycle time benefits. Twin-tape feeder technology also will be available for 12-mm taped SMD components. Assembléon, Eindhoven, The Netherlands.
SCREEN PRINTING
Fine-pitch Printer
SP200-AV semiautomatic stencil printer is said to control and regulate all printing parameters. All machine operations, including PCB positioning, are fully automatic. The system reportedly produces precise, reproducible printing results, and is designed for serial production but also can be used for small batches due to simple changeover. The system features a two-point vision system that is said to align PCBs precisely. Additionally two cameras look through the stencil onto the PCB for exact positioning for printing. Stencil cleanliness and alignment are checked simultaneously, and misalignment is corrected automatically. The printer can mount frames up to 584 × 584 mm, and the maximum printing area is 400 × 360 mm. ESSEMTEC USA LLC, Glassboro, N.J.
Emulsion Removal System
Reportedly capable of saving money on solvent use and disposal, Kleen-Screen automatic emulsion removal system automates both solvent application and high-pressure ..washing. The system eliminates hand application of solvent and wiping it off with rags by allowing operators to place screens into the front-loading system, closing the tempered-glass safety doors and specifying the frame size on the control panel. Inside the cabinet, an electro/pneumatic nozzle system consisting of four traveling spray heads is said to provide simultaneous, two-sided coverage that coordinates with the frame's dimensions, a method that reduces application time and maximizes solvent use. The automated cleaning system also is complemented by a closed-loop recirculating system for chemical recovery. A.W.T. World Trade Inc., Chicago, Ill.
Stencil Engineering System
ALPHA DIMENSIONS is a global stencil engineering system that is said to assist engineers with the task of designing and ordering stencils for SMT applications by automating the ordering process and provide standardization. The system automatically analyzes all stencil orders to recognize industry design rules, such as aspect ratio. If necessary, ALPHA DIMENSIONS will adjust to compensate for the effects of PCB shrink and stretch, resulting in stencil-board alignment. Alpha Metals Inc., Cookson Electronics Assembly Materials, Jersey City, N.J.
SOFTWARE
Pick-and-Place System Software
TPSys Linux-based pick-and-place system software is designed to speed up setup and changeovers with its operator guidance and database capabilities. New features in version 2.4 include automatic illumination settings for robust vision centering and barcode loading of tray components. The system is said to automatically optimize the illumination settings for the vision camera, ensuring a robust, successful inspection that will work with any batch of components from any supplier. More functions also are said to have been added to the test centering sequence, allowing the user to graphically verify the package model and contrast threshold values. Additionally, the software system features support for advanced network configurations,among other features. MYDATA automation AB, Stockholm, Sweden.
SOLDERING EQUIPMENT
Wave Solder Probe Kit
Wave solder probe kit reportedly can be used with a carrier and will adapt the Reflow Tracker thermal profiling system for monitoring the wavesoldering process. Users can view all wave process parameters in a table. Insight software for reflow tracker then analyzes data from both processes, ensuring data compatibility throughout the factory and minimizing operator training needs. Datapaq Inc. Wilmington, Mass.