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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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The Short Scoop: Introduction to Stencil Printing
Approximately 50% of defects that occur on an SMT assembly line can be attributed to the printing process. Doesn’t it seem odd, then, that instead of focusing on quality and experienced technical support, stencils have become a commodity and are being sold by a broad range of stencil suppliers, sometimes solely on the basis of price? At the same time, we continue to see more challenging requirements for stencil performance, driven by the continuous miniaturization of packages and components. Many different types of stencils are available today from many different suppliers, but not all stencils are created equal. And because the industry operates in a quick-turn, dynamic environment, industry lead-times for delivery, in many cases, are as important as the stencil’s capabilities.
Stencils range from the fairly straight-forward technology of a laser-cut stencil manufactured on some form of stainless steel material, to the high-end full-nickel electroformed stencil, along with many versions and variations in between. Stencil selection depends on the specific technology required for an application.Read the full column here.Editor's Note: This column originally appeared in the May 2013 issue of SMT Magazine.
More Columns from The Short Scoop
Adapting Stencils to Manufacturing Challenges in 2015The Short Scoop: Stencil Printing in PCB Cavities
The Short Scoop: Printing Two-level PCBs in One Step with a 3D Electroform Stencil
The Short Scoop: Improving Stencil Printing Results
The Short Scoop: More Stencil Questions (and the Answers!)
The Short Scoop: Selecting a Stencil Frame
The Short Scoop: Screen Printing Solutions for Small Die & Precision
The Short Scoop: 10 Common Stencil Questions