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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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The Short Scoop: Step Stencils, Part 2 - Applications and Solutions
In my last Short Scoop, (The Ins and Outs of Step Stencils, Part 1) you heard a little about step stencils--what they are, why demand is increasing, different types, and what to look for. In this column, we explore step stencil applications and solutions. Read the full column here.Editor's Note: This column originally appeared in the September 2013 issue of SMT Magazine.
More Columns from The Short Scoop
Adapting Stencils to Manufacturing Challenges in 2015The Short Scoop: Stencil Printing in PCB Cavities
The Short Scoop: Printing Two-level PCBs in One Step with a 3D Electroform Stencil
The Short Scoop: Improving Stencil Printing Results
The Short Scoop: More Stencil Questions (and the Answers!)
The Short Scoop: Selecting a Stencil Frame
The Short Scoop: Screen Printing Solutions for Small Die & Precision
The Short Scoop: 10 Common Stencil Questions