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Clyde Coombs Publishing 7th Edition of Printed Circuits Handbook
March 2, 2015 | I-Connect007Estimated reading time: Less than a minute

Clyde Coombs is ready to publish the latest edition of his "Bible of the Industry," the Printed Circuits Handbook. At the IPC APEX EXPO 2015 show in San Diego, Calif., Andy Shaughnessy and Coombs discuss the upcoming 7th edition of this book, which now includes PCB design and supply chain content. Shaughnessy also plugs his own contribution to the book in the section dealing with EDA software tools.
To watch this interview, click here.
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07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.
Flex CEO Sees US Manufacturing Resurgence
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The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics
06/18/2025 | Chris Mitchell -- Column: The Government CircuitI had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.