-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Advanced Printing for Microelectronic Packaging
March 11, 2015 | Kenneth H. Church, Xudong Chen, Joshua M. Goldfarb, Casey W. Perkowski, Samuel LeBlanc, nScrypt Inc.Estimated reading time: 16 minutes
A number of important printing factors need to be considered when printing fine lines. One is the diameter of the pen tip. Typically the inner diameter does not set the width of the dispense feature; this is usually set by the out diameter of the pen tip. In addition, there is a slumping issue. Most shear thinning materials will slump after being printed. Therefore to print a fine feature such as 100 microns, it is many times necessary to go to a smaller pen tip such as a 50/75. This implies 50 micron inner diameter and 75 micron outer diameter. Additionally, it will be important to get in proximity of the substrate. Proximity is affected by the pen tip diameter. If the diameter is very large (hundreds to thousands of microns) then the gap set between the pen tip and the substrate can be very large. The volume being dispensed will be very large. If the desire for small features is important, then the small gap will be important. Gaps on the order of microns and tens of microns can have an effect on printing as well. The flow rate for dispensing can be affected by the gap.
The flow rate of the pump (which determines the dispensed feature size) depends on the value of the pressure, the valve opening and the size of the tip orifice. Engineers and researchers at the company also discovered that the dispensing height (the gap between the dispensing nozzle tip and the substrate) plays a crucial role in the dispensing volume and especially when the feature size gets smaller or thin lines are printed. For these types of features the nozzle tip needs to be closer to the substrate. This will increase the flow resistance and thus reduce the flow rate. It is expected that the pressure drop will be dominated by the dispensing gap when the gap is 50% smaller than the tip size. By applying the above mentioned CFD (Computational Fluid Dynamic) model at various dispensing heights (Figure 2), the flow rates were calculated [5].
Figure 2. Schematic drawing of the CFD model.
The pressure drop with different dispensing heights is plotted in the Figure 3. At a very small gap (Figure 3a), the pressure
drop is dominated by the substrate. At a large gap (Figure 3c), the pressure drop is mainly determined by the tip orifice.
There is a transient region (Figure 3b) where the pressure drop is affected by both of them.
Figure 3. Pressure drop vs. different dispensing height. (a) 5 microns. (b) 15 microns. (c) 30 microns.
The flow rate vs. dispensing height is plotted in the Figure 4. It can be seen that the flow rate increases to a steady state value at the dispensing height that is proportional to the value of the pen tip diameter. The pressure moves the steady state flow rate with the lowest pressure achieving steady state the fastest. It is also obvious that the flow rate is sensitive to a change in dispensing heights if they are below a certain value (50 microns in this case). The lower the dispensing height, the more it affects the flow rate.
Figure 4. Flow Rate versus Dispense Height
Page 2 of 3
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.