-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
March 18, 2015 | Pete Starkey, I-Connect007Estimated reading time: 7 minutes
Morgan: I haven't quite finalized that yet. It might well be on the reliability topic, and I think it probably will be. I think of all the topics we've discussed in the last several years I'd have to say, this has become more and more important, and Europe is really a place where reliability is discussed day by day, hour by hour and it's really in the life blood of what we do in Europe. We have so many areas.
For example, when we think of the Swiss manufacturers, Swiss quality comes to mind, especially with reliability and medical devices. We think of defence and space, aeronautics. This morning we've been discussing with the European Space Agency and with guys from Airbus, again, on reliability and how that can be more built into the process. So I think the liability is a topic that we have as a very strong thread through what we do in Europe. So I think we'll probably focus more on that, and I think that will be something that will be interesting for people to listen to and something we can use to really differentiate our facilities and our production in Europe for the future.
Starkey: Michael, could I ask you what you believe should be the theme of the next EIPC conference, in addition to what Alun has already suggested?
Michael Weinhold: Well I think we have to bring the standardization process in line with the global requirements, and the EIPC is very much supportive in selling IPC standards. But on the international basis, the IEC standards and the UL standards are more related to safety standards, while the IPC standards more related to manufacturing standards. So the objective should be in the years to come, and also for my visit here in the United States at IPC meetings are the harmonization of the IPC requirements, which we have in Europe, and the safety requirements with the IEC requirements that we have to fulfill in Europe.
Starkey: To what extent, Michael, are standards controlled by the Western world? And to what extent are the Asian authorities beginning to impose their beliefs and their priorities on the next generation of standards?
Weinhold: Well, I think this is a very valid question, and we have seen this this morning when we were discussing the 4101, the laminate standards. Some concessions have to be made in the English language because certain words could not be translated into Chinese language, or could be misleading in Chinese language. So we have to understand that even if the standards are written here in the Western world, we have to consider the capability, or the ability to translate the standards into Chinese. Chinese represent approximately, at the moment, more than 40% of the global market, and therefore it is important. So we have to make sure that the standards are consistent, with IPC standards that they are harmonized with the IEC and the UL standards and at the same time that they are understandable in different languages, not only in English.
Starkey: But will it still be IPC and IEC that will set the lead with the standards, provided they are in harmony with the standards of China, Japan, Taiwan, etc.?Page 2 of 3
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.