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Suggested Items

Trouble in your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

10/26/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.

QSolid Shows What German Quantum Technology Can Achieve

10/23/2026 | Fraunhofer-Gesellschaft
For nearly five years, 26 research institutions, companies and start-ups have joined forces in QSolid to develop a quantum computer using cutting-edge German technology: a 30-qubit quantum chip with low error rates.

Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting

10/23/2026 | Global Electronics Association
The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron

10/22/2026 | Global Electronics Association
The Global Electronics Association hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/23/2026 | Marcy LaRont, I-Connect007
In my top five must-read items from this week’s articles and news, I am focusing on the interconnect because, honestly, who isn’t? We are in the interconnect business, and it just gets more complex and more fun every day. My interview with MKS Inc.’s Dr. John Lee and the accompanying article, which breaks down the technology, implications of current market realities, and their effect on the state of “the interconnect,” is my first choice this week.
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