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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Material Witness: Low-Flow Prepregs–Defining the Process
March 19, 2015 | Chet GuilesEstimated reading time: 5 minutes
What this looks like is shown in Figure 3. The sample involves three pieces of prepreg into which are punched two 1” diameter holes, as shown. After test, the resin has flowed into the circles (irregularly as shown in the middle diagram) and the average reduction in diameter of the circle as measured along several diameters is defined as the “flow. A typical low-flow product may flow into the holes in a range of 0.030” to as much as 0.150” depending on the grade and type. Measuring this manually has proved to have a great deal of inherent variability (as much as +/- 30% of nominal!), so use of a computerized automated measurement system as is indicated by the test coupon on the far right has been developed in which 500 to 1000 individual measurements are taken around the “diameter” of the flow bead and a statistical “best fit” circle is defined to determine the flow.
Although we have gotten something of a handle on the measurement method, the test itself remains somewhat variable, and correlation between test presses and between test facilities remains problematic. To be practical as a “real time” manufacturing test, the test procedure needs to be able to be completed in a relatively few minutes. The quality of die punched holes in the prepreg is critical, since any damage to prepreg edges will result in irregular flow. The IPC method also results in unrealistically high heat-up rates (several hundred degrees F per minute!) and not unexpectedly, irregular flow.
Users who employ test procedures based on normal PWB manufacturing processes with heat-up rates around 10oF/minute get better results, but the testing takes as long as a normal press cycle, far too long for a real-time prepreg manufacturing test. So what happens? We test using the IPC procedure. Many of our customers test in a realistic process simulation. And there is (surprise, surprise!) often poor correlation and the potential for issues in terms of how and whether specs have been met.
One of the unintended consequences of test methods that relate only marginally to in-use parameters is that individual products (rather than generic slash sheet designations) become locked into processes because engineers and shop floor people become familiar with their use and make the necessary adjustments in pressure and temperature, prepreg cut-backs, etc. so that they will work with a variety of designs. They come to have the belief that the product itself is infinitely process-flexible, and so anything new seems never to work quite like “Product X.” Different products, even if they are “the same” according to IPC testing (remember, this test uses a heat-up rate of several hundred degrees F/minute 200 psi on a 5.5 x 7 inch test specimen), do not necessarily work the same way in a real PWB process and the only way to really get the best out of any low flow product is to work with it in your own process until you are sufficiently familiar with it to make it jump through hoops.
I’m sure there are a few “miracle” prepregs out there that have inherent organic bio-feedback loops that adapt flow and viscosity to the specific design being manufactured, but for the most part we in the business have to be constrained by the laws of chemistry and physics, the limitations of human-designed processes, and the constraints of standard testing. Doing “the best we can with what we’ve got” is not a cheap excuse to avoid getting better; over the years we’ve improved materials and methods, and so have the guys producing PWBs. Working together we can evolve newer and better materials, provided we are willing to tune our processes to get the best out of them.
A topic for the future: How low-flow materials work in-process and what kinds of modifications of flow and viscosity have been made to open the process window with a minimum of pain.
Chet Guiles is a consultant for Arlon Electronic Materials.
Page 2 of 2Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?