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Indium Experts Investigate PCB Performance and Connectivity Solutions at SMTAI 2026

10/26/2026 | Indium Corporation
Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA International 2026, October 25–29, in Rosemont, Illinois.

SMTA Connecticut Chapter Announces Open House at Microscreen's New Manufacturing Facility

10/23/2026 | SMTA
The SMTA Connecticut Chapter is inviting electronics manufacturing professionals to an Open House at Microscreen's new stencil manufacturing facility in Oxford, Connecticut, on Thursday, December 10, 2026, from 4:00 PM to 7:00 PM.

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

10/22/2026 | SEHO Systems GmbH
SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China.

Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability

10/21/2026 | Thuy Nguyen, Hongwen Zhang, PhD, Ronald C. Lasky, PhD, and Adam Murling, Indium
Solder joint voiding remains a critical reliability concern in electronic packaging, particularly for high-performance and safety-critical applications such as automotive electronics. Excessive voiding can adversely affect both thermal conductivity and mechanical strength, leading to elevated junction temperatures, accelerated fatigue failure under thermal cycling, and ultimately reduce product lifetime.

Faster BGA Warpage Processing Without Shearing or Painting

10/21/2026 | Chris Gastaldo and Neil Hubble, Akrometrix
The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.
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