Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Benefits of Soldering with Vacuum Profiles
April 8, 2015 | Helmut Oettl, Rehm Thermal SystemsEstimated reading time: 4 minutes
Where modern vacuum systems are concerned, we no longer speak of simply evacuating the atmosphere, but rather the user is provided with the option of influencing the gradient at which the vacuum is generated and adjusting dwell time at a specified pressure. This provides, above all, sensitive components and volatile flux ingredients with the opportunity of adapting to prevailing ambient conditions. Damage to components or solder splashing may otherwise occur. However, this type of vacuum profiling must not be seen a separate step—it’s available for the entire duration of the soldering process. As a result, pressure can be adjusted in addition to the temperature profile, making it possible to fulfill various requirements. Moisture absorbed by the solder paste can be removed before soldering, or all of the process gas can be exchanged (i.e., at 160°C, in order to remove residues that have evaporated out of either the PCB material or the solder paste, and to assure that they don’t condense onto sensitive components (e.g., optics) during the cooling process). The CondensoX provides users with greatest possible flexibility in this respect, allowing them to respond to a vast variety of tasks and to influence the PCB assembly manufacturing process in a targeted and reproducible fashion.
Where modern vacuum systems are concerned, we no longer speak of simply evacuating the atmosphere, but rather the user is provided with the option of influencing the gradient at which the vacuum is generated and adjusting dwell time at a specified pressure. This provides, above all, sensitive components and volatile flux ingredients with the opportunity of adapting to prevailing ambient conditions. Damage to components or solder splashing may otherwise occur. However, this type of vacuum profiling must not be seen a separate step—it’s available for the entire duration of the soldering process. As a result, pressure can be adjusted in addition to the temperature profile, making it possible to fulfill various requirements. Moisture absorbed by the solder paste can be removed before soldering, or all of the process gas can be exchanged (i.e., at 160°C, in order to remove residues that have evaporated out of either the PCB material or the solder paste, and to assure that they don’t condense onto sensitive components (e.g., optics) during the cooling process). The CondensoX provides users with greatest possible flexibility in this respect, allowing them to respond to a vast variety of tasks and to influence the PCB assembly manufacturing process in a targeted and reproducible fashion.
The utilized vacuum and temperature profile is shown in Figure 4, with which BGA and QFN (BTC) components were soldered in the CondensoX during the course of the case study. Not only were the PCBs soldered with and without vacuum for the study—stencil apertures were varied as well. The goal was to demonstrate the extent to which void results can be influenced for both soldering processes.
Helmut Öttl is head of application and product management at Rehm Thermal Systems.
ABOUT REHM THERMAL SYSTEMS:
Today, over 450 creative minds work for Rehm worldwide and the product portfolio continues to grow. In addition to reflow soldering systems offering convection, condensation and vacuum processes, this also includes drying and coating systems, cold and hot function testing systems and systems for metallizing solar cells. Rehm has also gained an international reputation for developing individual special systems matched specifically to customer requirements. With production facilities in Germany and China and 26 representations in 24 countries, the company is an established entity and technological leader in the production of efficient machines for the economically viable production of electronic modules.
Page 2 of 2Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.