Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Workforce Partnerships Mean New Apprenticeships and Funding Opportunities

09/02/2026 | Victoria Hawkins, Global Electronics Association
Workforce development is most effective when employers have access to both a proven training model and the financial resources needed to implement it. At the Global Electronics Association, our workforce partnerships team is expanding those connections by helping electronics employers recruit, train, retain, and advance their workers through Registered Apprenticeship and industry-focused funding opportunities. We are excited to be in the final stages of preparing and submitting our newest Registered Apprenticeship occupation: wire harness assembler.

The Strategic Importance of Hiring Efficiency

08/18/2026 | I-Connect007
While discussions surrounding workforce shortages often focus on the number of available workers, many manufacturers face a different challenge: securing highly qualified candidates before competing employers do. We’re in a market where experienced PCB designers, process engineers, quality specialists, manufacturing engineers, and reliability professionals are in high demand, so even modest delays in the hiring process can have measurable business consequences.

SMT Perspectives & Prospects: The Architecture of Winston Churchill’s Leadership

07/24/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
I was recently invited to visit the U.S. Embassy and the Churchill War Rooms in London, where I met Warren Stephens, U.S. ambassador to the UK, and Bank of England Gov. Andrew Bailey. From those modern diplomatic corridors to the stark resolve of a wartime bunker, the experience reminded me that leadership in this ever-shifting global landscape is, at its best, about bridging the wisdom of the past with the realities of the present.

A Case Study in Conquering High Aspect Ratio Features

07/06/2026 | Richard Nichols, GreenSource Engineering
As demand for high-performance electronics is further driven by advances in AI and machine learning, the importance of high aspect ratio (HAR) through-holes in PCBs and IC substrates has become increasingly apparent. These vias play a vital role in enabling vertical interconnections in complex circuit architectures, especially within HDI structures, where maximizing space and enhancing electrical performance are crucial.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in