Enigma Boosts Capabilities; Installs New Via Filling System

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Enigma Interconnect has now installed the MASS VHF 200, the MASS ES 10 External Scavenger, and the MASS SV 100 Planarizer, all aimed at fulfilling the growing customer demand for filled and capped vias (via-in-pad), as well as controlled via plugging.

The three MASS machines work as a system to completely fill through-hole vias with conductive or non-conductive paste, scavenge the excess paste from the panel, and precisely planarize the surface of the panel prior to secondary plating which adds the cap.  Enigma is currently stocking the more popular non-conductive paste option but could switch to the conductive paste if there is a sufficient business case to support it in the future. 

The rapidly advancing capabilities in the manufacturing of printed circuit boards at Enigma are now strengthened further by this investment in the MASS via-filling system. The extremely dense feature spacing and high aspect ratio designs of today are increasingly requiring via-in-pad technology, and this system is capable of aspect ratios well beyond Enigma's current plating capabilities so will be one less thing to worry about as more new capabilities come on line.  By adding the via-filling process in house, Enigma can now offer customers the ability to maintain the quality control of filling vias without the added delay or cost associated with using an outside vendor. Enigma's ownership has clearly committed to invest in the equipment required for the latest technologies and it is imperative that everything be kept in-house in order to maintain the high level of process control and security that customers expect.