Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Graphic USA Adds PCB Veteran Frank Castro
June 18, 2015 | Graphic USAEstimated reading time: 1 minute
Frank Castro, a highly experienced and well regarded expert of the PCB Industry has joined Graphic USA, a global manufacturer of high-technology printed circuit boards. As Production Manager, Mr. Castro will oversee all of the manufacturing operations and processes of Graphic USA, with special emphasis on the engineering and manufacturing of Flex, Rigid Flex Circuits and Flex Heater products for the Medical, Military, Aerospace, Automotive and Consumer industries.
Most recently, Mr. Castro spent 12 years at Rigid Flex International where he also served as Production Manager and served many Southern California PCB Companies beginning with his early days at Hughes Aircraft (now Raytheon).
With the addition of Mr. Castro, Graphic USA continues on its path of long term investment in the US Market. With special expertise in the Flex Circuit and Rigid Flex Circuit Market, Graphic USA is able to offer the complete service from Application Engineering support to volume PCB manufacture. Graphic USA’s customers come from a wide range of industries including the Mil Aero, Medical and Commercial sectors.
Graphic USA is division of The Graphic Group, one of the most technically competent manufacturers of high-technology printed circuit boards. With headquarters in the UK and full service manufacturing facilities in the USA and China, The Graphic Group focuses on leading edge technology released to the most demanding international quality standards. HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind, buried, micro, copper and resin filled and stacked vias, sequential build-up, buried resistance and buried capacitance.
More Information can be found at www.graphic-usa.com and www.graphic.plc.uk,
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.