-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
A Review of the Opportunities and Processes for Printed Electronics (Part 1)
June 22, 2015 | Happy Holden, PCB Technologist-RetiredEstimated reading time: 7 minutes
Altogether, there are presently nine key manufacturing image transfer technologies that are either being employed or are proposed for PE production.
Traditional printing technologies:
- Screen printing
- Rotogravure printing
- Flexographic printing
- Offset printing
- Inkjet printing
- Imprinting and stamping
- Plasma printing
- Direct laser imaging or ablation
- Curtain and roller coating
Of these enabling technologies, stenciling and screen printing have been around the longest and both methods are still widely used in production today. Membrane switch technology, a clear member of the printed electronics family, relies heavily on screen printing to make products. Stencil printing and transfer printing are among the first printing technologies devised by man. One need only look to ancient human hand prints found on rock walls left by our ancestors who either placed their pigment covered hands on cave walls or sprayed pigments from their mouths at the backs of their hands held flush against the rocks to provide an outline of their five digit stencil. Those basic processes are still in use today, albeit with better equipment. For example, in the electronics manufacturing industry stencil printing remains the method of choice for printing solder ink onto printed circuits for SMT assembly.
Web printing of circuits has been in use for several decades. In the printed circuit industry, the benefits of printing circuits on a flexible base were seen very early and brought into practice by a number of companies including Sheldahl Corporation in Northfield, MN (now part of Multek, a division of Flextronics), which entered the flex circuit business as an extension of its involvement in the development of materials for the military in the early 1960s. Sheldahl engineers developed roll-to-roll processing using a step-and-repeat screen printing process for etch resist and an etching process to remove the background metals.
Over the years, web printing has been supplemented with different photolithographic methods, including direct write and, more recently, direct printing of catalytic toners and inks along with conductive and resistive inks and the printing of semiconducting materials. Rolltronics Corporation, a Silicon Valley technology company, was an early industry leader, pioneering what is now called printed electronics during the late 1990s and early 2000s. Rolltronics developed flexible electronic device printing technology and roll-to-roll production processes for low-cost, durable, thin-film switch arrays for display backplanes, sensors and other large area circuits. They were targeting the technology for products such as standard and custom backplane displays based on ultra-thin flexible structures with integral LCD-like switchable materials that they were printing into the product. Unfortunately, the company’s vision did not come to fruition as a result of market timing and/or positioning.
Figure 1: Overview of how printing techniques compare for resolution versus throughput. Curtain/roller coating is similar to other roll-to-roll techniques and soft lithography is a photo-imageable technique that is off the scale to the left.
In Part 2 of this article series, Happy Holden digs deep into the different technologies that are being used for PE production.
Editor's Note: This paper has been published in the proceedings of SMTA International.
Page 2 of 2Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.