Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
Seika Machinery Now Carries MALCOM RDT-250C Reflow Simulator
July 7, 2015 | Seika Machinery, Inc.Estimated reading time: 1 minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, now carries the MALCOM RDT-250C Reflow Simulator. The system can reproduce the temperature profile of a reflow oven while allowing operators to observe the melting state of solder paste and record the process.
The local matrix control system of the upper heater enables reflow soldering of the PCB in which the thermal capacity is balanced with the best heating temperature. Low power consumption provides excellent cost/performance benefits. Additionally, the RDT-250C can accommodate full size PCB boards for testing (250 x 330mm).
Each heating stage sets the temperature as well as the time. This makes it possible to change the time that keeps the reflow peak temperature free. The operator can observe the state of soldering through wide glass windows from the rear of the unit. An optional video camera capture system can be purchased to record the reflow process with profiles.
The system reproduces nearly the same conditions as an actual reflow oven by using the hot air of the upper-heater and the extreme infrared radiation of the lower heater together.
The MALCOM RDT-250C can heat in N2 atmospheres and control the N2 concentration with the O2 Oxygen Analyzer, OAS-1, and N2 flow adjustable function (OAS-1 is optional). For more information, contact Michelle Ogihara at michelle@seikausa.com or visit www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.