The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
Global Citizenship: What I’ve Learned About the American PCB Business
IWLPC Program Finalized and Registration Now Open
August 13, 2015 | SMTAEstimated reading time: 1 minute
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
The conference, held October 13 and 14, includes three tracks of technical paper presentations covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging. A strong lineup of plenary speakers and panelists from the world of 3D and MEMS was assembled to provide success stories and offer a glimpse of new and emerging technologies and applications.
Rama Alapati, Director of Package Architecture & Customer Technology (PACT) at GLOBALFOUNDRIES, is scheduled to give the keynote presentation the first day of the conference on “High Density Fan-Out: Evolution or Revolution.”
Sitaram Arkalgud, VP of 3D Technology at Invensas, will deliver the keynote on the second day, titled “2.5D/3D IC - Examining Low Cost Alternatives.”
The exhibition showcasing over 60 solutions providers covering everything from materials to equipment and market research to metrology will run concurrently with the conference on October 13 and 14. Though mostly sold out, a few booths still remain in the exhibition.
On Thursday, October 15, four application-oriented tutorials on Fan-Out Wafer Level Packaging, 3D ICs, Temporary Bonding of Electronics (Wafers, Displays, Devices), and Wafer Level Packaging for MEMS and Microsystems Technologies for Size and Cost Reductions will be instructed by experts in the field including Beth Keser, Ph.D., Qualcomm; John H. Lau, Ph.D., ASM Pacific Technology; Jared Pettit, Alex Brewer, Alman Law, and John Moore, DAETEC; and Leland "Chip" Spangler, Ph.D., Aspen Microsystems, LLC.
Visit http://www.iwlpc.com for more information.
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Chip Scale Review, now entering its 18th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.
Share on:
Suggested Items
Biden-Harris Administration: CHIPS Incentives Awards with BAE Systems and Rocket Lab
11/27/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
11/26/2024 | SMTAThe SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico
11/26/2024 | PlasmatreatOn-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.