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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Polar Instruments Launches New Language Versions of The Speedstack PCB Layer Stackup Design System
August 18, 2015 | Polar InstrumentsEstimated reading time: 2 minutes
Key Facts:
- Accurate PCB stackup data can be shared between OEM designers and
- PCB fabricators in the local language of key markets
- Increases the ease of use for customers in Germany, Japan and China
- Exports stackup documentation in a range of industry-standard formats
- Supports fast optimisation of PCB costs and manufacturing yields
- Consistent communication throughout the supply chain
Polar Instruments - a specialist provider of tools for high speed PCB design, fabrication and test - has launched new language versions of Speedstack, the industry’s best-selling PCB layer stackup design system. In addition to English, Speedstack is now available in German, Japanese, simplified Chinese and traditional Chinese versions.
“Customer demand was a strong factor in our decision to offer Speedstack in multiple language versions,” explains Martyn Gaudion, CEO of Polar Instruments. “One of the key strengths of the Speedstack system is its ability to accurately document detailed specifications for each layer in a PCB stackup. Providing OEM designers and PCB fabricators with the ability to share these specifications in their local language further enhances the speed and ease of using the Speedstack system for PCB stackup design.”
Speedstack is already licensed with OEM designers, PCB technologists and PCB fabricators worldwide, providing an ultra-fast process for creating and accurately documenting stackups for High-Density Interconnect (HDI) and flex-rigid PCBs. The system also allows PCB fabricators to fine-tune the stackup design by assessing the impact of different PCB materials on cost, performance and manufacturing yield. The accurate stackup data generated by Speedstack can be exported in different industry-standard formats and shared with companies throughout the PCB supply-chain.
About Polar Instruments
Polar Instruments is a market leader in design and manufacturing tools to simplify and enhance the design, fabrication and testing of printed circuit boards (PCBs). Their innovative tools include the industry-standard Controlled Impedance Test System (CITS) which provides the global PCB industry with an easy-to-use test system for high-speed digital and RF boards, as well as class-leading tools for fast and accurate design and testing of controlled impedance in PCBs. Polar also leads the industry in tools for automated PCB layer stackup design and documentation. Polar Instruments was established in 1976 and has offices and branded operations in the US, UK, Europe and Asia Pacific. www.polarinstruments.com
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.