-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
GOEPEL Launches Boundary Scan Integration into SPEA ICT System
September 3, 2015 | GOEPEL ElectronicsEstimated reading time: 1 minute
GOEPEL electronics announces the availability of Boundary Scan integration into SPEA’s multi-core ICT (in-circuit test) platform. With the level of integration provided for the SPEA3030 ICT, execution of interactive Boundary Scan tests is now possible on all cores of the ICT (up to four). This results in maximization of parallelism and productivity.
Implementation in the multi-core system now offers even higher throughput for the test process. Parallel work and simultaneous execution of different test sequences opens up technological and economic advantages. Various types of projects including parallel test of several UUTs (Unit under Test) can be handled easily.
The Boundary Scan integration option from GOEPEL electronics has been available in selected in-circuit test systems by SPEA for several years. The Boundary Scan hardware architecture has been integrated into the ICT adapter system with the system software CASCON. The combination of ICT and Boundary Scan test procedures makes for the highest test coverage possible.
The new integration enables real parallel test execution involving all resources of the SPEA3030 ICT. The SPEA software LEONARDO initializes the tests of the Boundary Scan software CASCON, which is able to activate measurement and driver instruments of the ICT. Thereby a real interaction between Boundary Scan and the individual ICT cores is achieved. CASCON then transfers the test results to the SPEA software and assigns them to the respective cores.
About GOEPEL electronic
GOEPEL electronics is a worldwide leading vendor of innovative electronic and optical test and inspection systems, being the market leader for professional JTAG/Boundary Scan solutions for Embedded System Access (ESA). A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of the more than 8,000 system installations. Founded in 1991 and headquartered in Jena/Germany, GOEPEL electronics employs currently more than 215 employees and generated a revenue of 30 Million Euro in 2014 (ca. $32 Mio). GOEPEL electronics has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. GOEPEL electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries.
Suggested Items
DuPont Announces Additional Directors for the Planned Independent Electronics Company
04/18/2025 | DuPontDuPont announced that Karin De Bondt and Anne Noonan will become members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont, which is targeted for November 1, 2025.
Navigating Robotics Deployment Challenges with SINBON
04/18/2025 | PRNewswireIn spite of the potential for robotics technology to expand productivity, several implementation challenges continue to stand in the way of more widespread adoption.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.