Marcy’s Musings: From Pitch to PO—The Sales Stack
It’s Only Common Sense: Knowing When to Walk Away
Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
Rogers to Offer Practical Material Solutions at PCB West 2015
September 3, 2015 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will be at PCB West, one of the electronic industry’s major technical events, on September 16, 2015 at the Santa Clara Convention Center (Santa Clara, CA). Rogers will provide examples of its high-performance printed-circuit-board (PCB) materials and participate in the technical symposium with a talk on how to perform wideband testing of PCBs with plated finishes.
Rogers’ personnel will be at Booth 200 with examples of high-frequency circuit materials, including Rogers RO4835™, RO4360G2™ and RO3003™ high performance laminates.
Rogers RO4835 high-frequency laminates, specially formulated with enhanced oxidation resistance, were developed for applications needing improved electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. Just as with RO4350B™ material, RO4835 laminates offer a dielectric constant of 3.48 at 10 GHz, a low loss tangent of 0.0037 at 10 GHz, and low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability across a wide range of processing and operating conditions.
These improved oxidation resistant circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard fabrication methods. Typical applications include automotive radar and sensors, point-to-point microwave backhaul units, power amplifiers and phased-array radar.
For designers seeking further circuit miniaturization, Rogers will also be showing its RO4360G2 circuit laminates. These circuit materials have a tailored high Dk of 6.15 @ 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminates’ higher Dk allows for a significant reduction in finished circuit board size (approximately 25-30% in most cases). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B material.
With a UL 94V-0 flame rating and fully lead-free process capable, RO4360G2 laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B material.
RO3003 laminates have tightly controlled dielectric constant (3.04+/-0.04 at 10GHz) and very stable dielectric constant performance over temperature (-3 ppm/°C from -50°C to 150°C). The RO3003 PTFE-ceramic composite resin system enables very low dielectric loss (0.0010 at 10GHZ), and laminates can be purchased with rolled copper to further enhance PCB insertion loss performance. Due to its excellent electrical properties, RO3003 laminates are often chosen for millimeter wave applications such as 77-79GHz automotive radar sensors and 60GHz point to point backhaul applications.
As part of the PCB West 2015 technical conference, Rogers’ Technical Marketing Manager John Coonrod, author of the popular ROG Blog series, will be presenting “Wideband Insertion Loss Testing of Multiple PCB Final Plated Finishes”. Admission to the presentation, which is part of session F1 scheduled for September 16, 9:00 -10:00 AM, is free of charge for all exhibition and conference attendees.
About Rogers Corporation
Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety, and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.