Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
ESCATEC Solves Problem of Overheating High Brightness LEDs
September 7, 2015 | ESCATECEstimated reading time: 1 minute
ESCATEC, one of Europe's leading providers of contract design and manufacturing services, will be launching its solution to the challenge of effectively cooling high brightness LEDs on its stand E8 at the LED Professional Symposium 2015 in Bregenz, Austria on 22-24 September 2015.
ESCATEC's Heat Spreader solution solders the LEDs onto a copper substrate, which is up to ten times more effective at dissipating the heat generated by the LEDs than current solutions. The CoolRunning design means that LEDs with a power density of up to 10W per mm2 could be passively cooled.
The Heat Spreader was developed in response to a customer visit to ESCATEC's FutureLab where novel and innovative solutions are developed for LED applications. "Heat dissipation is always a challenge for LEDs as their compact size means that the LEDs can be packed close together to form a powerful illumination source but that also forms a highly concentrated heat source, for example, when a hundred 5 Amp LEDs are side by side," explained Wolfgang Plank, Manager of the FutureLab. "Our novel Heat Spreader solution opens up compact, high power LEDs of, say 1000W, to be used in many new applications such as stage lighting, architectural illumination and video projectors."
By starting from the bare LED die, ESCATEC can customise the solution with regards to the size of the package, the shape of the beam so that there are minimal losses, and the wavelength of the light along with its intensity. This freedom of design enables the LED solution to be highly efficient, appropriately cooled and optimised for the required power consumption. It also enables the lens or lens array to be custom made to provide the exact optics required by the application and ensures that design can be compact with high optical efficiency.
About ESCATEC
The ESCATEC Group provides fully-integrated electronic and mechatronic design and manufacturing solutions to assist customers in achieving success in their market. Its one-stop solutions and best-in-class service enable companies around the world to operate more profitably, sustainably and efficiently. Founded in 1984, its history is full of innovation, which made it a first choice partner for many European and North American OEMs. The Swiss-owned company perfectly blends Swiss business philosophy and attention to quality, precision and detail with the advantage of low-cost, mass-volume manufacturing capabilities in its Asian factories.
Share on:
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.