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Ersa to Exhibit at the SMTA Long Island Expo & Tech Forum
September 21, 2015 | ErsaEstimated reading time: Less than a minute
Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Wednesday, Oct. 14, 2015 at the Islandia Marriott Long Island in Islandia, NY. Company representatives will discuss the complete Ersa product line, including the new Smartflow 2020 selective soldering system.
The Smartflow 2020 selective soldering system requires less than 3 m² of space, thus fitting optimally into cell production environments. In all process steps the automatic Smartflow system uses the same successful and proven Ersa Selective Soldering Technology as the large Ersa VERSAFLOW systems without compromising quality and accuracy. With the Smartflow, ERSA finally closes the gap from its high end Versaflow platform to an entry level machine. Due to its universal pallet fastening, the Smartflow can handle PCB sizes of up to 508 x 508 mm [20” x 20”].
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05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
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SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.