Marcy’s Musings: From Pitch to PO—The Sales Stack
It’s Only Common Sense: Knowing When to Walk Away
Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
AISMALIBAR Ramps Up Production of Bond Sheet Prepreg and Thin Lam Cores
September 22, 2015 | AismalibarEstimated reading time: 1 minute
AISMALIBAR has increased production of their HTC Bond Sheet Prepreg and Thin Lam Cores. Customers have been using HTC Bond Sheets to connect cutting edge high power LEDs mounted on MPCBs to heat sinks to allow for superior heat dissipation. They are also using both the Bond Sheets and Thin Lam together to press custom IMS multilayer builds providing industry leading dielectric strength, thermal conductivity and thermal lifespan.
Jeff Brandman, President of Aismalibar North America, says “We are excited to see our customers use our Bond Sheets and Thin Lam in creative ways to build new products. Our customers continue to find innovative applications for these high performance materials.”
HTC Bond Sheets are a B-Stage glass reinforced dielectric prepreg with a high thermal conductivity. They are created with an epoxy ceramic chemistry and are intended for the effective bonding between PCBs and heat sinks.
HTC Thin Lam is a double-sided copper clad thin laminate composed of a thermally conductive polymeric glass reinforced prepreg used to produce double sided and multilayer PCBs. The Thin Lam typically bonds to a metal heat dissipater using standard multilayer lamination processes with HTC Bond Sheets.
As the dielectric layers get reduced, testing electric insulation becomes more important. It is a regular policy at AISMALIBAR to realize constant quality control standards in order to high pot test 100% of the substrates before delivery to end users. This guarantees the dielectric insulation of the copper and aluminium conductive layers.
Cobritherm has been approved by top OEMs around the world with a focus on the automotive, lighting and power electronics industries. It has collected excellent results in endurance testing and has the UL Recognition as one of the best Insulated Metal Substrates after 60,000 hours.
About Aismalibar
AISMALIBAR was one of the first IMS laminate manufacturers in the world and was the first in Europe. AISMALIBAR is proud to introduce their material to the North American market in 2012. Their product IMS Cobritherm ® is a qualified and recognized Insulated Metal Substrate which gives the best thermal management solutions with high thermal conductivity, low thermal impedance and high dielectric capacity. AISMALIBAR has implement a 100% proof test with 1-3KV (High Pot Test) to all IMS laminates coming out of their plant. This is the only way to insure the dialectical strength is perfect and that production problems are detected before PCBs arrive to the end user.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.