Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
ZESTRON's Umut Tosun to Present at SMTA International 2015
September 24, 2015 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Umut Tosun, M.S.Ch.E., Application Technology Manager, ZESTRON Americas, will present “Impact of Multiple Thermal Cycles on the Cleaning Process” at SMTA International 2015.
Printed circuit board manufacturing is a highly complex process and incorporates numerous steps. The soldering process is critical and may include reflow oven and/or wave solder equipment as well as a baking process. PCBs may be single or double-sided in which case multiple thermal cycles are required. There are many opportunities to clean PCBs following a soldering process, either from single, dual or dual and baked thermal cycles. This study was conducted to assess the effects of numerous thermal cycles on the PCB cleaning process. Solder pastes considered included RMA, No Clean and Water Soluble (OA), both leaded and lead-free.
SMTA International 2015 will be held at the Donald Stephens Convention Center in Rosemont, IL from September 29 to September 30. Mr. Tosun will present during the “Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies” session on September 30, at 8:00 AM. For more information on our process solutions, services and learning opportunities, please visit booth #616.
About ZESTRON
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide Technical Centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.