-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Inaugural Boards, Chips and Packaging IMPACT Conference Adds 15 Industry Experts to Presentation List
October 1, 2015 | IsolaEstimated reading time: 3 minutes

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced today that the inaugural Board, Chips and Packaging: Designing to Maximize Results Conference is garnering significant interest from the embedded design community with the addition of 15 industry experts to the agenda. The one-day conference will be held October 13, 2015 at the Computer History Museum in Mountain View, California. The event was developed to support PCB, chip and packaging-design companies' focus on system-level integration across the entire hardware development process.
Captain Chesley B. “Sully” Sullenberger III will be one of the keynote speakers at the event. Captain Sullenberger, best known for serving as Captain during what has been called the “Miracle on the Hudson,” is known for his expertise in safety and knowledge of improvements of high-performance systems to save lives, save money and bring value to communities.
Jim Feldhan, President of Semico Research noted, “We have been very pleased with the response we have received from the industry thus far. We have 15 industry experts speaking at the event. One of the most anticipated panel sessions will focus on designing and manufacturing products that will proactively address next-generation networking product needs. This is an excellent example of a technical topic that needs to be addressed at the system-level with input from both the hardware and software aspects of product development efforts.”
Jeff McCreary, President and CEO of Isola stated, “This event is a platform in which the true system-level issues of the electronics industry can be addressed. At Isola, we embrace the rapid advancements in the embedded market with a strategy of continuing innovation to provide our customers with better performance, service and products. Ultimately, this allows Isola to partner with companies across the value chain to develop and commercialize innovative solutions.”
Designing new or revising existing hardware is not an easy task. Hardware is not nearly as malleable as software; it is not possible to upgrade hardware via a new software download. Modifications to one part of a hardware design can affect other parts of the design in an unforeseen manner and changes to existing hardware designs are rarely, if ever, inexpensive. Boards, Chips and Packaging: Designing to Maximize Results will cover a variety of industry topics such as solutions to implement successful product launches; technical, personnel and engineering challenges faced by every very-high speed system design team; and material selection to avoid hardware failure.
Sponsors of the event include Isola Group, Mentor Graphics, Ansys, Samtec, Speeding Edge and Polar Instruments. Noted speakers include Michael J. Gay of Isola Group, Lee Ritchey of Speeding Edge, Scott McMorrow of Samtec, Daniel DeAraujo of Mentor Graphics, Robert L. Sankman of Intel, Margaret Schmitt of Ansys, Nathaniel Unger of Altera, Mike Noonen of Silicon Catalyst, Heidi Barnes of Keysight Technologies, Geoffrey Hazelett of Polar Instruments, Jason Marsh of Insulectro, Tom Whipple of Cadence, and Nathapong Suthiwongsunthorn of UTAC. Brian Fuller of ARM will moderate the morning panel.
For more information and to register for the event, please visit www.semico.com or contact Jim Feldhan or Joanne Itow from Semico Research at 602-997-0337.
About Isola
Isola Group, headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multi-layer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit our website at http://www.isola−group.com/.
About Semico
Semico Research Corp. is a semiconductor marketing & consulting research company located in Phoenix, Arizona. Semico was founded in 1994 by a group of semiconductor industry experts. We have improved the validity of semiconductor product forecasts via technology roadmaps in end-use markets. Semico offers custom consulting, portfolio packages, individual market research studies and premier industry conferences.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.