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Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

11/09/2026 | I-Connect007
I-Connect007 is excited to welcome Dr. Cody Schoener of Dow as a new monthly columnist for our weekly Mil/Aero Newsletter. His column, Electronic Armor, will explore the materials and technologies used to protect electronics in demanding military, aerospace, and aviation environments.

Learning With Leo: Observations from IPC Builds in Paris

11/04/2026 | Leo Lambert -- Column: Learning With Leo
I spent a week in Paris in September at the IPC Builds meetings, and it gave me the chance to see, take part in, and document a broad range of technical and training-related discussions affecting the electronics manufacturing industry. I go to these meetings because what gets decided in those rooms ends up in the classes we teach at EPTAC. In addition to attending committee meetings, I participated in keeping minutes for several sessions because some meeting leaders were unable to attend due to travel restrictions.

The Chemical Connection: A Few Things That Still Scare Me

10/29/2026 | Don Ball -- Column: The Chemical Connection
The PCB fabrication industry is constantly changing and throwing new challenges our way. Initially, these changes and evolutions can be frightening, but we’ve always managed to adapt, incorporate these them into our processes, and continue on. But what do some of us find frightening in the industry environment now and in the near future?

October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

U.S AEP Success Rides on Navigating Three Key Market Trends

10/16/2026 | Nolan Johnson, I-Connect007
The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.
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