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The SMTA is pleased to announce the Call for Abstracts for the 10th Annual International Conference on Soldering and Reliability May 9-11, 2016 in Toronto, Ontario, Canada. The deadline to submit an abstract is January 15, 2016.
Suggested topics to be covered include:
- Lead-free Assembly Processes, including Test
- Solder Joint Reliability under Temp Cycling, Mechanical Shock/Drop, After Aging
- Harsh Environment
- Tin Whiskers
- Electromigration
- Thermal Dissipation
- Environmental Compliance/Regulations
- Conformal Coating
- Nano-interconnects
- Package on Package
- Manufacturing Process
- Mechatronics
- Corrosion
- Halogen-Free Laminates
- High Density Interconnects
- Thermal Interface Materials
- Chip and Board Level Underfills, including solder joint encapsulants
- Printed Electronics
- Lead Free Die Attach Soldering
- Nano-scale Soldering Materials and Processes
- New Solder Paste Technologies
- Flex Circuits soldering and assembly
- Wearables
- Entertainment Systems
- UPL
- LED
- Robots/Drones
- Alternative Interconnects
- E Surface
- IMAX
If you are interested in presenting, please submit a 200-300 word abstract to www.smta.org/icsr/abstracts. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February 15, 2016. Technical papers and presentations are required and will be due on March 21, 2016.
The SMTA Toronto Expo and Tech Forum will be held in conjunction with ICSR.
For more information or to submit an abstract visit: http://www.smta.org/icsr
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
