-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Seeks Abstracts for 10th Annual ICSR
October 21, 2015 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the Call for Abstracts for the 10th Annual International Conference on Soldering and Reliability May 9-11, 2016 in Toronto, Ontario, Canada. The deadline to submit an abstract is January 15, 2016.
Suggested topics to be covered include:
- Lead-free Assembly Processes, including Test
- Solder Joint Reliability under Temp Cycling, Mechanical Shock/Drop, After Aging
- Harsh Environment
- Tin Whiskers
- Electromigration
- Thermal Dissipation
- Environmental Compliance/Regulations
- Conformal Coating
- Nano-interconnects
- Package on Package
- Manufacturing Process
- Mechatronics
- Corrosion
- Halogen-Free Laminates
- High Density Interconnects
- Thermal Interface Materials
- Chip and Board Level Underfills, including solder joint encapsulants
- Printed Electronics
- Lead Free Die Attach Soldering
- Nano-scale Soldering Materials and Processes
- New Solder Paste Technologies
- Flex Circuits soldering and assembly
- Wearables
- Entertainment Systems
- UPL
- LED
- Robots/Drones
- Alternative Interconnects
- E Surface
- IMAX
If you are interested in presenting, please submit a 200-300 word abstract to www.smta.org/icsr/abstracts. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February 15, 2016. Technical papers and presentations are required and will be due on March 21, 2016.
The SMTA Toronto Expo and Tech Forum will be held in conjunction with ICSR.
For more information or to submit an abstract visit: http://www.smta.org/icsr
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.