-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Flex Circuit Shielding Design Options
October 22, 2015 | Mike Morando, PFC Flexible CircuitsEstimated reading time: 4 minutes
In December of 2014 I visited the Radiological Society of North America (RSNA) conference in Chicago. As you can imagine, MRI and X-ray equipment filled the convention center. Attending the show gave me the opportunity to speak to radiology designers. Since the equipment they are designing “radiates” with waves of electrons, the underlying electronics have to be super protected for fear of interference. When discussing flex designs, EMI and shielding circuits is the number one design concern.
Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.
The Basics: What is EMI and Do Flex Circuits Radiate?
Electromagnetic radiation that adversely affects circuit performance is generally termed EMI, or electromagnetic interference. Many types of electronic circuits are susceptible to EMI and must be shielded to ensure proper performance. Conversely, emissions radiating from sources inside electronic equipment may threaten circuits within the same or nearby equipment.
To protect the performance integrity of electronic equipment, electromagnetic emissions from commercial equipment must not exceed levels set by the FCC, VDE and other organizations. Shielding requirements for commercial electronics generally range from 40–60 dB. Finding a system's overall shielding needs involves determining the radiated emission spectrum of the equipment, and the specifications the unit must meet (e.g. FCC Part 15).
And yes, flex circuits will radiate.
What is EMI shielding?
Shielding is the use of conductive materials to reduce radiated EMI by reflection and/or absorption. Shielding can be applied to different areas of the electronic package from equipment enclosures to individual circuit boards or devices. Effective placement of shielding causes an abrupt discontinuity in the path of electromagnetic waves. At low frequencies, most of the wave energy is reflected from a shield's surface, while a smaller portion is absorbed. At higher frequencies, absorption generally predominates. Shielding performance is a function of the properties and configuration of the shielding material (conductivity, permeability and thickness), the frequency, and distance from the source to the shield.
Flex shielding methodology
Shielding a flex circuit can be accomplished through multiple methods. Shields are designed and used for EMI and ESD considerations as well as signal integrity methodology. Here are some common and not so common practices for shielding a flex circuit.
- Copper-clad—adding additional copper layers to the circuit—the least flexible method.
Figure 1: Very thick outside copper layers supressing radiation.
- Copper cross hatch—adding additional copper layers and etching them to create a cross hatch design which allows more flexibility than standard copper-clad layers. Benefit: More flexible than pure copper layers.
Figure 2: Outer layer cross hatch for EMI suppression. Benefit: More flexible than pure copper layers.
- Silver paste/epoxy—achieved by applying a conductive paste over the outer layers of a circuit. The Kapton® covercoat has holes. Silver paste is sprayed on the covercoat and the silver paste drains down the holes and makes contact with the copper ground inside the circuit. This technique allows a slightly more flexible design than the copper-clad solution mentioned above. Benefit: More flexible. Downside: higher cost.Page 1 of 2
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.