-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MIRTEC to Exhibit the All New MV-6 OMNI at productronica
October 22, 2015 | MirtecEstimated reading time: 2 minutes
MIRTEC, “The Global Leader in Inspection Technology,” will premier the technologically advanced MV-6 OMNI 3D Series in Hall A2, Stand 139 at the upcoming Productronica international trade fair, scheduled to take place November 10-13, at the Messe in Munich, Germany.
The new high-speed, high-performance 3D AOI machine boasts 15 mega pixel CoaXPress camera technology, as well as advanced eight phase color lighting system. The machine includes a ten micron/pixel prevision telecentric compound lens design, integrated ten mega pixel side-viewer camera system, and a precision closed loop AC servo drive motor system.
The MV-6 OMNI has extremely simple programming and operation, and is priced at under €100k (while supplies last).
Also on display will be Mirtec’s flagship, the MV-9 AOI system, which achieves the highest productivity and ultimate inspection performance, falls calls will be avoided. For the 3D measurement the MV-9 system is working with the "Shadow Free" Moiré Phase Shift image processing. Additionally it is equipped with the 6 Phase colour lighting system for an optimized recognition of lifted leads. At the show, the MV-9 will be linked to a YXLON Cheetah with SmartLoop.
The MV-9 utilizes a high resolution digital 15 MP camera technology with telecentric lens. The four 10 MP side cameras (Side-Viewer®) offer a spacial test and provide valuable information for a secure and reliable detection of side defects. Also, the inspection of complex components is greatly enhanced. The MV-9 is now also available with a 25 MP camera and 7.7 µm lens for components down to 03015.
Also on display will be the MS-15 In-Line SPI System. It also uses the shadow free Moiré Phase Shift Imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient or excessive solder, shape deformity, shift of deposition and bridging. The MS-15 uses the same high precision platform as MIRTEC’s MV-9 Series.
Both systems, the MV-9 and the MS-15, can additionally be equipped with the new CoaXPress which leads to an increase of inspection speed of around 25% compared to the standard camera technology. CoaXPress combines the simplicity of coaxial cable with state of the art high speed serial data technology. The combination of these two features provides a revolutionary leap forward in high speed image and data transmission.
The MV-3 Desktop AOI System has been designed to automatically inspect for manufacturing defects both pre and post reflow. The MV-3 systems offer superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc. The system software is very powerful yet extremely simple to use. With its perfect cost-performance ratio this system addresses especially companies with small and medium productions.
Finally, stop by Hall A4, Stand 506 to see an MS-11 and MV-7OMNI linked to the YXLON Cheetah X-ray system showing SmartLoop.
For more information, or to schedule a demo, contact your Mirtec sales representative or stop by Hall A2, Stand 139, or Hall A4, Stand 506 at Productronica.
Suggested Items
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.