-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Speedline Launches MPM Edison Next Generation Printer Platform
October 27, 2015 | Speedline Technologies, Inc.Estimated reading time: 2 minutes
Speedline Technologies announces the introduction of MPM Edison, the next generation in printing technology. Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform. Featuring outstanding speed, accuracy, and performance surpassing best-in-class SMT printers worldwide, Edison is built to excel in every way, with patented features throughout its design. Edison operates at twice the speed and 25% higher accuracy than current printers, achieved by Speedline engineers re-thinking the printing machine from top to bottom.
Edison delivers an unheard-of higher throughput than competitive printers –15 seconds total throughput, including stencil wipe cycle. That’s due in part to an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, and other cycle time reduction and innovations so that Edison delivers double the throughput of best-in-class printers worldwide.
Edison features unbeatable accuracy. Edison has built-in 8 micron alignment, and 15 micron wet print repeatability (>2 Cpk @ 6ó) proven through 3rd party Print Capability Analysis (PCA) testing. This represents a 25% improvement in wet print accuracy over current best-in-class printing machines.
Edison performs superbly with SMT Fine Pitch solder paste printing for small apertures (<.3mm CSP’s, 01005’s), and Edison is powered by an intuitive, new software operating system, Intueri, that’s easy to set up and use. Intueri features Speedline’s Open Apps Interface (OAI), a revolutionary new ‘open architecture’ machine communications and control system enabling customers to develop their own apps while directly integrating with their MES for unheard-of levels of process optimization and integration, anticipating Industry 4.0 goals.
Edison’s ‘smart’ operation requires less operator intervention, and can be configured back-to-back to create a dual lane processing solution without increasing line length. Edison features a compact footprint and low cost of ownership. Other significantly improved features include EdgeLoc and a Foil Clamp system, plus an all new parallel processing stencil shuttle system, wiper, vision gantry, squeegee head, and improved serviceability of motors and sensors.
MPM Edison will be exhibited at Productronica 2015 in Munich, Germany, November 10 – 13, 2015, in Hall A4, Booth 554, with other Speedline products as well as products and new technologies presented by other members of the ITW Electronics Assembly Equipment Group, of which Speedline Technologies is a member.
About Speedline Technologies
Speedline Technologies, a member of the ITW Electronics Assembly Equipment Group (Illinois Tool Works, Inc. (NYSE: ITW), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts, USA, with Electrovert manufacturing based in Camdenton, Missouri, the company markets four best-in-class brands: MPM stencil and screen printing systems; Camalot dispensing systems; Electrovert wave soldering, reflow soldering and cleaning equipment; and Accel microelectronics cleaning equipment.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.