-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Intertronics Launches New Fast-curing Adhesive Bonds Polypropylene and Polyethylene
October 28, 2015 | IntertronicsEstimated reading time: Less than a minute
There is an increasing demand for a fast-curing structural adhesive capable of providing robust direct adhesion to low surface energy plastics. L&L A-K540 from Intertronics is a new, innovative structural adhesive. It is unique in that it combines direct adhesion – without primers or plasma, corona, or flame treatment – to low energy substrates such as polypropylene and polyethylene thermoplastics, with very fast cure speeds at room temperature. A-K540 is also capable of bonding a multitude of other substrates, enabling combinations of polyolefin plastics with metal and composite substrates.
A-K540 is a two-component methacrylate based structural adhesive which is fast curing (with a fixture time of just 45-60 minutes). It has high tensile strength and impact resistance with robust long term durability for applications in challenging operating conditions. It is resistant to weathering, e.g. salt spray and QUV radiation – properties developed in response to its original purpose in vehicle assembly applications where it has proven extremely successful worldwide, offering exemplary performance as a high strength, light-weight structural adhesive for major motor manufacturers.
Suggested Items
ZenaTech’s ZenaDrone Tests Proprietary Camera Enabling IQ Nano Drone Swarms for US Defense Applications, Blue UAS Submission
05/09/2025 | Globe NewswireZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drones, Drone as a Service (DaaS), enterprise SaaS, and Quantum Computing solutions, announces that its subsidiary ZenaDrone is testing a new proprietary specialized camera that enables more efficient indoor applications such as inventory and security management, when utilizing IQ Nano drone swarms for commercial and US defense applications.
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma ElectronicElma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Elektrobit, Metoak Forge Strategic Partnership to Establish New Benchmark for Intelligent Driving Safety Ecosystem
04/29/2025 | ElektrobitElektrobit announced a comprehensive strategic partnership with Metoak, a leading Chinese provider of intelligent driving solutions.