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Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Intertronics Launches New Fast-curing Adhesive Bonds Polypropylene and Polyethylene
October 28, 2015 | IntertronicsEstimated reading time: Less than a minute
There is an increasing demand for a fast-curing structural adhesive capable of providing robust direct adhesion to low surface energy plastics. L&L A-K540 from Intertronics is a new, innovative structural adhesive. It is unique in that it combines direct adhesion – without primers or plasma, corona, or flame treatment – to low energy substrates such as polypropylene and polyethylene thermoplastics, with very fast cure speeds at room temperature. A-K540 is also capable of bonding a multitude of other substrates, enabling combinations of polyolefin plastics with metal and composite substrates.
A-K540 is a two-component methacrylate based structural adhesive which is fast curing (with a fixture time of just 45-60 minutes). It has high tensile strength and impact resistance with robust long term durability for applications in challenging operating conditions. It is resistant to weathering, e.g. salt spray and QUV radiation – properties developed in response to its original purpose in vehicle assembly applications where it has proven extremely successful worldwide, offering exemplary performance as a high strength, light-weight structural adhesive for major motor manufacturers.
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