-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Intertronics Launches New Fast-curing Adhesive Bonds Polypropylene and Polyethylene
October 28, 2015 | IntertronicsEstimated reading time: Less than a minute
There is an increasing demand for a fast-curing structural adhesive capable of providing robust direct adhesion to low surface energy plastics. L&L A-K540 from Intertronics is a new, innovative structural adhesive. It is unique in that it combines direct adhesion – without primers or plasma, corona, or flame treatment – to low energy substrates such as polypropylene and polyethylene thermoplastics, with very fast cure speeds at room temperature. A-K540 is also capable of bonding a multitude of other substrates, enabling combinations of polyolefin plastics with metal and composite substrates.
A-K540 is a two-component methacrylate based structural adhesive which is fast curing (with a fixture time of just 45-60 minutes). It has high tensile strength and impact resistance with robust long term durability for applications in challenging operating conditions. It is resistant to weathering, e.g. salt spray and QUV radiation – properties developed in response to its original purpose in vehicle assembly applications where it has proven extremely successful worldwide, offering exemplary performance as a high strength, light-weight structural adhesive for major motor manufacturers.
Suggested Items
Transforming the Future of Mobility: DuPont Unveils Silver Nanowire Products in South Korea
04/17/2025 | DuPontDuPont will showcase its state-of-the-art products that incorporate silver nanowire technologies in Hall D, Booth A31 at Electronics Manufacturing Korea (EMK) and Automotive World Korea (AWK) exhibitions from April 16 to 18.
Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions
04/16/2025 | BUSINESS WIRENortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.
QpiAI Announces Dawn of Quantum Era in India With 25 Qubit Quantum Computer
04/16/2025 | BUSINESS WIREQpiAI, a leader in quantum computing and generative AI, announced its First Quantum computer launch code named QpiAI Indus Quantum Computer.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
04/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh density interconnect (HDI) printed circuit boards have come a long way from their origins as a niche technology for miniaturized applications. Today, HDI PCBs are at the forefront of innovation, driven by an insatiable demand for faster, smaller, and more powerful electronic devices. As consumer electronics, 5G infrastructure, and AI-driven systems advance, design engineers must stay ahead of the curve to ensure their PCB designs meet evolving industry demands.