Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
SMTA Seeks Papers for 2016 Events
October 29, 2015 | SMTAEstimated reading time: Less than a minute
SMTA announced that abstracts are now being accepted for several events taking place in 2016. All submissions must be non-commercial in nature and focus on technology research rather than a company product. The following events are all currently soliciting abstracts:
South East Asia Technical Training Conference on Electronics Assembly Technologies
Abstracts Deadline: January 4th, 2016
International Conference on Soldering and Reliability (ICSR)
Abstract Deadline: January 15, 2016
Abstract Deadline: February 12, 2016
International Wafer-Level Packaging Conference (IWLPC)
Abstract Deadline: April 16, 2016
On-line Presentations (Webinars & Webtorials)
Now scheduling for 2016 - Contact Jenny, jenny@smta.org
Now accepting papers for 2016 publication - Contact Ryan, ryan@smta.org
Submission of an abstract for an SMTA program is with the understanding that, if accepted, the author will provide a conference presentation and/or a technical paper for the proceedings.
View details online: www.smta.org/education/call-for-participation.cfm. Please contact Jenny Ng, jenny@smta.org or 952-920-7682, with questions.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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