-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ECT’s LFRE Plating Extends Probe Life and Time Between Cleaning Cycles
November 3, 2015 | Everett Charles TechnologiesEstimated reading time: 2 minutes
Everett Charles Technologies (ECT) has proven the exceptional performance of LFRE spring probe products in a challenging evaluation at a major automotive electronics supplier with global manufacturing facilities. The ECT LFRE probes, which were used in an in-circuit test fixture, tripled insertion life and reduced cleaning frequency by a factor of 10 compared to the original set up.
ECT LFRE probes meet the challenges of lead free pads. Lead free solder has a higher reflow temperature, which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder resin and oxides can also increase debris transfer to spring probes. These are many of the issues found in OSP (Organic Solderability Preservatives) and no-clean applications.
ECT’s proprietary LFRE plated probes have two key attributes that make it an ideal choice for the most challenging PCB test applications. LFRE provides a smooth, slick plating surface that not only resists wear but also resists solder and debris transfer. ECT’s LFRE plating is also significantly harder than the industry’s standard gold plating and has a hardness range of 550 to 650 Knoop. This makes the probe tips much more durable and less susceptible to solder and material transfer. LFRE probes incorporate a double roll close, which offers the industry’s best pointing accuracy. Increased pointing accuracy is of benefit when using lead free solder and/or no-clean as the probe is less likely to touch the edge of the pad where the solder flux accumulates.
Tony DeRosa, Product Manager, highlights: “The customer was experiencing excessive cleaning, short probe life, and low first pass yield. Contamination due to excessive solder flux was limiting probe life to only 60k insertions. We were able to improve insertion life to more than 180k cycles and to reduce the cleaning frequency to 2-3 times per week.”
LFRE plated probes leverage ECT’s long-term expertise in materials and platings along with probe fabrication knowledge. The LFLT probe - the long travel version of the LFRE probe - incorporates ECT’s proven PogoPlus bias ball design and double roll close process. Both of which contribute to making sustainable and reliable contact to PCB targets.
LFRE Pogo pins are available in a variety of spring force choices and pitches. All of ECT’s lead free (LFRE) probes have a spring fatigue life that surpasses 500,000 cycles.
About Everett Charles Technologies (ECT)
ECT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. R&D programs address engineering and materials issues that will affect Contact Solutions for the next decade. Methods for maintaining electrical continuity in miniature probes, improved spring technologies, and probe head geometries are under continual review. ECT POGO ® contacts are marketed worldwide through sales offices in the United States, Europe and Asia. ECT is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.