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SHENMAO America Inc., one of the world’s major solder materials providers, will be showcasing its products at the joint MEPTEC and SEMI symposium with the theme "The Great Miniaturization: Systems and Packaging" from November 10–11 at the Biltmore Hotel in Santa Clara, California.
Packaging technologies, manufacturing solutions, as well as the business models that support production must evolve to meet the challenges that the new era of mobile miniaturization will produce. The two-day symposium will highlight the technologies enabling device integration and advanced packaging, which in turn are driving electronic systems personal mobility.
The first day will address the applications that drive the technology; while the second day will cover emerging technologies and a wrap-up panel discussion with the experts. Each day will feature an industry leading keynote speaker.
At the symposium, SHENMAO will be featuring its products including SMT solder paste, wave solder bar, solder wire and flux, solder preforms, semiconductor packaging solder spheres, wafer bumping solder paste, dipping flux and PV ribbon. SHENMAO's solder materials, solder pastes and fluxes are made locally in the United States and with the same quality as in its nine other locations worldwide. Their low viscosity (easy to apply), high tackiness (slump resistant), and consistent printability create highly reliable solder joints with optimum maximized quality.
For more information, on the symposium, click here. To register, click here.
To find out more about SHENMAO America, visit www.shenmao.com.
